3/30/2024 | 38249999 | The chemical mixture has basic ingredients of Nickel sulfate and Nickel chloride Ni-1850Ni. (CTHH: NiSO4 (CAS: 10101-97-0) and NiCl2 (CAS: 7791-20-0), used for electroplating) | XXXXXXXXXX | 990 | KGM | 12384.9 | Japan | NA |
3/30/2024 | 38249999 | The chemical mixture has basic ingredients of Boric Acid and Magnesium Sulphate Ni-1850C. (CTHH: HBO3 (CAS: 10043-35-3) and MgSO4 (CAS: 7487-88-9), used for electroplating) | XXXXXXXXXX | 180 | KGM | 1582.2 | Japan | NA |
3/29/2024 | 38249999 | 0#&MICROFILL EVF-III LEVELER solution contains 90-99% water, Sulfuric Acid 0.1 - < 1.0%, Copper sulfate 0.1 - < 1.0% used in electroplating technology, 100% new | XXXXXXXXXX | 300 | LTR | 11700 | Taiwan | NA |
3/29/2024 | 38249999 | 0#&Chemical YSP-250 used in electroplating industry (composition N-propyl alcohol 71-23-8 12%; Sulfuric acid 3%; N-(2-chloro-4-pyridyl)-Nphenylurea 68157-60-8 1%), Manufacturer: Yushin Technopia Co., Ltd (Korea), 100% new | XXXXXXXXXX | 640 | KGM | 1765.76 | South Korea | NA |
3/28/2024 | 38249999 | 73302023#&Additive product in electroplating Copper Gleam(TM)ST-901BM(J) helps prevent copper plating on the convex surface of the circuit board, including 7732-18-5(80-90%),OxyalkylenePolymer(1-10% ),7758-98-7(0.1-1%),7664-93-9(<1%)new100% | XXXXXXXXXX | 1400 | LTR | 0.7 | Japan | NA |
3/28/2024 | 3824999990 | The chemical product is a mixture of sodium and copper salts used in electroplating CUPRACID ULTRA B (25Kg/Can)( bis-(3-sulfopropyl)-disulfide, disodium salt, copper sulphate). 100% brand new #&CN | XXXXXXXXXX | 75 | KGM | 827.25 | VIETNAM | NA |
3/28/2024 | 38249999 | 07020122#&Microfill EVF Brightener Solution contains Water 90-99%, Sulfuric Acid 1-5%, Copper sulfate <1%, Formaldehyde 0.1 - <1% used in electroplating technology-20L/T.100% new | XXXXXXXXXX | 200 | LTR | 2820 | Taiwan | NA |
3/28/2024 | 3824999990 | Chemical preparations used in electroplating technology CUPRACID ULTRA MAKE-UP (25Kg/Can)(sulphuric acid <3%, Copper Sulfate, bis-(3-sulfopropyl)-disulfide, disodium salt). 100% new product #&CN | XXXXXXXXXX | 100 | KGM | 1019 | VIETNAM | NA |
3/28/2024 | 38249999 | 07020130#&MICROFILL THF 100 B-1(TM) solution containing 90-99% Water, Sulfuric Acid 1-5%, Copper sulfate <1%, Formaldehyde 0.1 - < 1% used in electroplating technology-20L/ T.100% New | XXXXXXXXXX | 300 | LTR | 11148 | Taiwan | NA |
3/28/2024 | 3824999990 | Cuposit (TM) 253E Electroless Copper product is an additive in electroplating, creating complexes in plating, maintaining the necessary amount of Cu ions; includes Cas: 7732-18-5 (50-60%), 64-02-8 (30-40%), Propoxylated amine(<1%); 100% new#&TW | XXXXXXXXXX | 500 | LTR | 3190 | VIETNAM | NA |