Get Latest Vietnam Import Data of Electroplating rectifier under HS Code 38249999

Discover latest Vietnam shipment data of Electroplating rectifier under HS code 38249999. Find Product description, Price, buyer, supplier name, Port & shipping information. Ultilize these valuable insights for implementing successful marketing strategy. Scale your Business with our authentic Vietnam Import Data.


DATEHS CODEPRODUCT DESCRIPTIONEXPORTERQUANTITYUNITTOTAL VALUE USDORIGIN COUNTRYPORT OF UNLOADING
3/30/202438249999The chemical mixture has basic ingredients of Nickel sulfate and Nickel chloride Ni-1850Ni. (CTHH: NiSO4 (CAS: 10101-97-0) and NiCl2 (CAS: 7791-20-0), used for electroplating)XXXXXXXXXX990KGM12384.9JapanNA
3/30/202438249999The chemical mixture has basic ingredients of Boric Acid and Magnesium Sulphate Ni-1850C. (CTHH: HBO3 (CAS: 10043-35-3) and MgSO4 (CAS: 7487-88-9), used for electroplating)XXXXXXXXXX180KGM1582.2JapanNA
3/29/2024382499990#&MICROFILL EVF-III LEVELER solution contains 90-99% water, Sulfuric Acid 0.1 - < 1.0%, Copper sulfate 0.1 - < 1.0% used in electroplating technology, 100% newXXXXXXXXXX300LTR11700TaiwanNA
3/29/2024382499990#&Chemical YSP-250 used in electroplating industry (composition N-propyl alcohol 71-23-8 12%; Sulfuric acid 3%; N-(2-chloro-4-pyridyl)-Nphenylurea 68157-60-8 1%), Manufacturer: Yushin Technopia Co., Ltd (Korea), 100% newXXXXXXXXXX640KGM1765.76South KoreaNA
3/28/20243824999973302023#&Additive product in electroplating Copper Gleam(TM)ST-901BM(J) helps prevent copper plating on the convex surface of the circuit board, including 7732-18-5(80-90%),OxyalkylenePolymer(1-10% ),7758-98-7(0.1-1%),7664-93-9(<1%)new100%XXXXXXXXXX1400LTR0.7JapanNA
3/28/20243824999990The chemical product is a mixture of sodium and copper salts used in electroplating CUPRACID ULTRA B (25Kg/Can)( bis-(3-sulfopropyl)-disulfide, disodium salt, copper sulphate). 100% brand new #&CNXXXXXXXXXX75KGM827.25VIETNAMNA
3/28/20243824999907020122#&Microfill EVF Brightener Solution contains Water 90-99%, Sulfuric Acid 1-5%, Copper sulfate <1%, Formaldehyde 0.1 - <1% used in electroplating technology-20L/T.100% newXXXXXXXXXX200LTR2820TaiwanNA
3/28/20243824999990Chemical preparations used in electroplating technology CUPRACID ULTRA MAKE-UP (25Kg/Can)(sulphuric acid <3%, Copper Sulfate, bis-(3-sulfopropyl)-disulfide, disodium salt). 100% new product #&CNXXXXXXXXXX100KGM1019VIETNAMNA
3/28/20243824999907020130#&MICROFILL THF 100 B-1(TM) solution containing 90-99% Water, Sulfuric Acid 1-5%, Copper sulfate <1%, Formaldehyde 0.1 - < 1% used in electroplating technology-20L/ T.100% NewXXXXXXXXXX300LTR11148TaiwanNA
3/28/20243824999990Cuposit (TM) 253E Electroless Copper product is an additive in electroplating, creating complexes in plating, maintaining the necessary amount of Cu ions; includes Cas: 7732-18-5 (50-60%), 64-02-8 (30-40%), Propoxylated amine(<1%); 100% new#&TWXXXXXXXXXX500LTR3190VIETNAMNA

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