| 3/31/2024 | 29181590 | -#&Powder used in metal plating pH ADJUSTMENT BASIC A. City: Organic acid salt >99% - CAS 6100-05-6. NSX Electroplating Engineers of Japan Ltd. Used in metal plating industry. 100% new.#&JP | XXXXXXXXXX | 10 | KGM | 380.79 | Japan | NA |
| 3/30/2024 | 29171100 | Solid Potassium Oxalate (used for electroplating workshops, not for medical use), CAS: 6487-48-5. | XXXXXXXXXX | 0.5 | KGM | 17.97 | Japan | NA |
| 3/30/2024 | 28092099 | Polyphosphoric acid. (CTHH: HO(-P(O)(OH)-O-)nH. CAS: 8017-16-1, used for electroplating workshops) | XXXXXXXXXX | 22 | KGM | 1481.04 | Japan | NA |
| 3/30/2024 | 28353990 | Potassium pyrophosphate. (CTHH: K4P2O7. CAS: 7320-34-5, used for electroplating workshops) | XXXXXXXXXX | 500 | KGM | 5280 | Japan | NA |
| 3/30/2024 | 74198070 | Copper anode used for electroplating | XXXXXXXXXX | 180 | KGM | 2480.4 | Japan | NA |
| 3/30/2024 | 38249999 | The chemical mixture has basic ingredients of Nickel sulfate and Nickel chloride Ni-1850Ni. (CTHH: NiSO4 (CAS: 10101-97-0) and NiCl2 (CAS: 7791-20-0), used for electroplating) | XXXXXXXXXX | 990 | KGM | 12384.9 | Japan | NA |
| 3/30/2024 | 38249999 | The chemical mixture has basic ingredients of Boric Acid and Magnesium Sulphate Ni-1850C. (CTHH: HBO3 (CAS: 10043-35-3) and MgSO4 (CAS: 7487-88-9), used for electroplating) | XXXXXXXXXX | 180 | KGM | 1582.2 | Japan | NA |
| 3/30/2024 | 28142000 | Ammonia solution (CTHH: NH3. CAS: 1336-21-6, used for electroplating) | XXXXXXXXXX | 40 | LTR | 294.72 | Japan | NA |
| 3/30/2024 | 29094300 | 2-(2-n-Butoxyethoxy) ethanol (other name: Monobutyl ether of diethylene glycol) (used for electroplating workshops, CTHH: C8H18O3. CAS: 112-34-5) | XXXXXXXXXX | 2.5 | LTR | 63.25 | Japan | NA |
| 3/30/2024 | 28353990 | Copper pyrophosphate (CTHH: Cu2P2O7. CAS: 15191-80-7, used for electroplating workshops) | XXXXXXXXXX | 120 | KGM | 2181.6 | Japan | NA |