| 3/28/2024 | 38249999 | 07020330#&Copper Gleam(TM)HS-200 Part A solution contains water90-99%;Sulfuric acid0.1-1%;1-Propanesulfonic acid,3,3'dithiobis-,disodium sal1-5%;Copper sulfate 0.1 -1% used in electronics industry - 20L/TM | XXXXXXXXXX | 100 | LTR | 2015 | Taiwan | NA |
| 3/27/2024 | 38249999 | 07020330#&Copper Gleam(TM)HS-200 Part A solution contains water90-99%;Sulfuric acid0.1-1%;1-Propanesulfonic acid,3,3'dithiobis-,disodium sal1-5%;Copper sulfate 0.1 -1% used in electronics industry - 20L/TM | XXXXXXXXXX | 100 | LTR | 2015 | Taiwan | NA |
| 3/26/2024 | 39122019 | NITROCELLULOSE RS 1/4 SEC. (Primary unplasticized nitro cellulose in powder form), 100% new, similar to PTPL results No. 47/PTPLHCM-NV dated January 6, 2012, 32kgs/drum, understanding RS 1/4 SEC. | XXXXXXXXXX | 14976 | KGM | 71884.8 | Taiwan | NA |
| 3/26/2024 | 38249999 | 07020330#&Copper Gleam(TM)HS-200 Part A solution contains water90-99%;Sulfuric acid0.1-1%;1-Propanesulfonic acid,3,3'dithiobis-,disodium sal1-5%;Copper sulfate 0.1 -1% used in electronics industry - 20L/TM | XXXXXXXXXX | 100 | LTR | 2015 | Taiwan | NA |
| 3/26/2024 | 38249999 | Copper Gleam (TM) HS-200 Part A solution contains 90-99% water; Sulfuric acid 0.1-<1% (7664-93-9 ); 1-Propanesulfonic acid, 3,3'dithiobis-1-5% (27206-35-5); Copper sulfate 0.1-<1% (7758-98-7) | XXXXXXXXXX | 260 | LTR | 5488.834 | Taiwan | NA |
| 3/26/2024 | 39122019 | NITROCELLULOSE RS 1/2 SEC. (Primary unplasticized nitro cellulose in powder form), 100% new, similar to results of PTPL No. 47/PTPLHCM-NV dated January 6, 2012, 28kgs/drum, understanding RS 1/2 SEC. | XXXXXXXXXX | 2016 | KGM | 9676.8 | Taiwan | NA |
| 3/26/2024 | 39122019 | NITROCELLULOSE RS 1/8 SEC. (Primary unplasticized nitro cellulose in powder form), 100% new, similar to PTPL results No. 47/PTPLHCM-NV dated January 6, 2012, 32kgs/drum, understanding RS 1/8 SEC. | XXXXXXXXXX | 5760 | KGM | 27648 | Taiwan | NA |
| 3/25/2024 | 38249999 | 07020330#&Copper Gleam(TM)HS-200 Part A solution contains water90-99%;Sulfuric acid0.1-1%;1-Propanesulfonic acid,3,3'dithiobis-,disodium sal1-5%;Copper sulfate 0.1 -1% used in electronics industry - 20L/TM | XXXXXXXXXX | 100 | LTR | 2015 | Taiwan | NA |
| 3/25/2024 | 38249999 | 07020330#&Copper Gleam(TM)HS-200 Part A solution contains water90-99%;Sulfuric acid0.1-1%;1-Propanesulfonic acid,3,3'dithiobis-,disodium sal1-5%;Copper sulfate 0.1 -1% used in electronics industry - 20L/TM | XXXXXXXXXX | 200 | LTR | 4030 | Taiwan | NA |
| 3/25/2024 | 38249999 | 07020330#&Copper Gleam(TM)HS-200 Part A solution contains water90-99%;Sulfuric acid0.1-1%;1-Propanesulfonic acid,3,3'dithiobis-,disodium sal1-5%;Copper sulfate 0.1 -1% used in electronics industry - 20L/TM | XXXXXXXXXX | 400 | LTR | 8060 | Taiwan | NA |