| 3/30/2024 | 38249999 | .#&Additive solution for copper electrolysis ELC-MPS -C, ingredients: Sodium Hydroxide (<30%), Ethylenediaminetetraaceticacid disodium salt (<2%) 20 liters/barrel | XXXXXXXXXX | 4800 | LTR | 5656.32 | Vietnam | NA |
| 3/29/2024 | 38249999 | MM02-00239A#&NIMUDEN CHEMICAL;,NPR-4-M (CONTAINS Ammonium lactate <15%; Sodium hypophosphite <11%; Ammonium succinate <10%; Succinic acid <10%) USED IN CIRCUIT BOARD MANUFACTURING | XXXXXXXXXX | 1280 | LTR | 9664 | South Korea | NA |
| 3/29/2024 | 38249999 | MM02-00239F#&NIMUDEN CHEMICAL;,NPR-4-B (CONTAINS Sodium hypophosphite <32 %; Ammonium succinate <2%; Ammonium lactate <2%) USED FOR CIRCUIT BOARD MANUFACTURING | XXXXXXXXXX | 640 | LTR | 6387.2 | South Korea | NA |
| 3/29/2024 | 3824999990 | Printing ink additive (66-AD-LT-1) Temperature, TP: ( DIMETHYL GLUTARATE (1119-40-0) 50-70%, DIMETHYL ADIPATE(627-93-0) 10-30%, DIMETHYL SUCCINATE(106 -65-0) 10-30%) used to increase the adhesion of printing ink, 100% new#&HK | XXXXXXXXXX | 2 | KGM | 158.4722 | VIETNAM | NA |
| 3/28/2024 | 3824999990 | The chemical product is a mixture of sodium and copper salts used in electroplating CUPRACID ULTRA B (25Kg/Can)( bis-(3-sulfopropyl)-disulfide, disodium salt, copper sulphate). 100% brand new #&CN | XXXXXXXXXX | 75 | KGM | 827.25 | VIETNAM | NA |
| 3/28/2024 | 3824999990 | Chemical preparations used in electroplating technology CUPRACID ULTRA MAKE-UP (25Kg/Can)(sulphuric acid <3%, Copper Sulfate, bis-(3-sulfopropyl)-disulfide, disodium salt). 100% new product #&CN | XXXXXXXXXX | 100 | KGM | 1019 | VIETNAM | NA |
| 3/28/2024 | 3824999990 | Additive solution for copper electrolysis ELC-MPS -C, ingredients: Sodium Hydroxide (<30%), Ethylenediaminetetraaceticacid disodium salt (<2%) 20 liters/barrel#&VN | XXXXXXXXXX | 4800 | LTR | 5656.32 | VIETNAM | NA |
| 3/28/2024 | 3824999990 | Additive for alloy plating (Ni-P) ENF-C, used in plating industry, liquid form, 20L/can; TP: Sodium hydroxide 10-18%, Malic acid 2-5%, Adipic acid 5-8%, Sodium succinate dibasic 1-3%#&VN | XXXXXXXXXX | 1600 | LTR | 1761.28 | VIETNAM | NA |
| 3/28/2024 | 38249999 | 07020330#&Copper Gleam(TM)HS-200 Part A solution contains water90-99%;Sulfuric acid0.1-1%;1-Propanesulfonic acid,3,3'dithiobis-,disodium sal1-5%;Copper sulfate 0.1 -1% used in electronics industry - 20L/TM | XXXXXXXXXX | 100 | LTR | 2015 | Taiwan | NA |
| 3/27/2024 | 38249999 | 07020330#&Copper Gleam(TM)HS-200 Part A solution contains water90-99%;Sulfuric acid0.1-1%;1-Propanesulfonic acid,3,3'dithiobis-,disodium sal1-5%;Copper sulfate 0.1 -1% used in electronics industry - 20L/TM | XXXXXXXXXX | 100 | LTR | 2015 | Taiwan | NA |