| 3/28/2024 | 35069900 | 34# & Glue (adhesive) - Glue-C-05 ingredients N,N-diethyl-Formamide 11%, Synthetic resin 83%, additive 6%, used in leather shoe manufacturing industry, Branded (brand: TRUSTY INK) | XXXXXXXXXX | 15 | KGM | 62.25 | Vietnam | NA |
| 3/28/2024 | 35069900 | 34# & Glue (adhesive) - Glue-C-05 ingredients N,N-diethyl-Formamide 11%, Synthetic resin 83%, additive 6%, used in leather shoe manufacturing industry, Branded (brand: TRUSTY INK) | XXXXXXXXXX | 15 | KGM | 62.25 | Vietnam | NA |
| 3/28/2024 | 35069900 | 34# & Glue (adhesive) - Glue-C-05 ingredients N,N-diethyl-Formamide 11%, Synthetic resin 83%, additive 6%, used in leather shoe manufacturing industry, Branded (brand: TRUSTY INK) | XXXXXXXXXX | 30 | KGM | 124.5 | Vietnam | NA |
| 3/28/2024 | 35069900 | MM900005277#&SX-ECA52LL ADHESIVE (Contains Copper and its compounds 30-40%; Silver 10-20%; 3-Methoxy-3-methyl-1-butanol, Diethylene glycol diethyl ether,) USED FOR ATTACHING COMPONENTS | XXXXXXXXXX | 1420 | GRM | 10877.768 | Japan | NA |
| 3/23/2024 | 35069900 | C-05 glue ingredients N,N-diethyl-Formamide 11%, Synthetic resin 83%, additive 6%, used in leather shoe manufacturing industry, has brand (brand: TRUSTY INK). 100% new product#&VN | XXXXXXXXXX | 15 | KGM | 62.25 | VIETNAM | NA |
| 3/23/2024 | 35069900 | C-05 glue ingredients N,N-diethyl-Formamide 11%, Synthetic resin 83%, additive 6%, used in leather shoe manufacturing industry, has brand (brand: TRUSTY INK). 100% new product#&VN | XXXXXXXXXX | 30 | KGM | 124.5 | VIETNAM | NA |
| 3/22/2024 | 35069900 | C-05 glue ingredients N,N-diethyl-Formamide 11%, Synthetic resin 83%, additive 6%, used in leather shoe manufacturing industry, has brand (brand: TRUSTY INK). 100% new product#&VN | XXXXXXXXXX | 15 | KGM | 62.25 | VIETNAM | NA |
| 3/16/2024 | 35069900 | MM900005172#&SX-ECA52LL ADHESIVE (Contains Copper and its compounds 30-40%; Silver 10-20%; 3-Methoxy-3-methyl-1-butanol, Diethylene glycol diethyl ether,) USED FOR ATTACHING COMPONENTS | XXXXXXXXXX | 3000 | GRM | 22728.9 | Japan | NA |
| 3/12/2024 | 35069900 | 430-01240-003#&Expoxy glue used to glue electronic components (tp:N-PENTYL-ISOPENTYLPHTHALATE ,DI-N-HEXYL PHTHALATE ,1,2-BENZENEDICARBOXYLIC ACID, DI-C6-8-BRANCHED ALKYL ESTERS ,) new 100% | XXXXXXXXXX | 16000 | GRM | 779.2 | China | NA |
| 3/8/2024 | 35069900 | 0201-003490#&ADHESIVE SX-ECA52LL (Contains Copper and its compounds 30-40%; Silver 10-20%; 3-Methoxy-3-methyl-1-butanol, Diethylene glycol diethyl ether,) USED FOR ATTACHING COMPONENTS | XXXXXXXXXX | 2620 | GRM | 20096.71 | Japan | NA |