| 3/28/2024 | 35069900 | MM900005277#&SX-ECA52LL ADHESIVE (Contains Copper and its compounds 30-40%; Silver 10-20%; 3-Methoxy-3-methyl-1-butanol, Diethylene glycol diethyl ether,) USED FOR ATTACHING COMPONENTS | XXXXXXXXXX | 1420 | GRM | 10877.768 | Japan | NA |
| 3/18/2024 | 38123900 | 00001073#&Compound used as surface stabilizer for PVC flexible film, liquid, ingredients include: Zinc Diethyl Zinc (CAS: 557-20-0), Calcium nitrate (CAS: 10124-37-5), Benzoic acid ( CAS: 65-85-0), 100% new | XXXXXXXXXX | 16 | KGM | 151.64 | Japan | NA |
| 3/17/2024 | 38121000 | Vulcanization accelerator used in rubber production EUR, TP: N,N'-diethyl thiourea (105-55-5 <99%). 100% New | XXXXXXXXXX | 10 | KGM | 177.9 | Japan | NA |
| 3/16/2024 | 35069900 | MM900005172#&SX-ECA52LL ADHESIVE (Contains Copper and its compounds 30-40%; Silver 10-20%; 3-Methoxy-3-methyl-1-butanol, Diethylene glycol diethyl ether,) USED FOR ATTACHING COMPONENTS | XXXXXXXXXX | 3000 | GRM | 22728.9 | Japan | NA |
| 3/13/2024 | 34029019 | Mold release agent TSM630 NF, TP: Alcohols, C16-18, ethoxylated (68439-49-6 )<1%, bronopol (INN); 2-bromo-2-nitropropane-1,3-diol (52-51-7) <0.01% | XXXXXXXXXX | 1 | UNL | 245.831 | Japan | NA |
| 3/8/2024 | 29055900 | 512874#&Preservative (kills bacteria, yeast, mold, repels insects) SANAI BAC SA, ingredient 2-Bromo-2-nitro-1 ,3-propanediol C3H6O4NBR, cas: 52-51-7 | XXXXXXXXXX | 20 | KGM | 183.7 | Japan | NA |
| 3/8/2024 | 35069900 | 0201-003490#&ADHESIVE SX-ECA52LL (Contains Copper and its compounds 30-40%; Silver 10-20%; 3-Methoxy-3-methyl-1-butanol, Diethylene glycol diethyl ether,) USED FOR ATTACHING COMPONENTS | XXXXXXXXXX | 2620 | GRM | 20096.71 | Japan | NA |
| 3/7/2024 | 32073000 | Electrode paint for printing material plates in the production of instant heating tools, type SP-7016, packaged 0.5kg/box. TP: Silver power 83%, Diethyl phthalate 7-12%.nsx:Shin-Nihon Kakin Co.Ltd, 100% new | XXXXXXXXXX | 1 | KGM | 1050 | Japan | NA |
| 2/21/2024 | 35069900 | 0201-003490#&ADHESIVE SX-ECA52LL (Contains Copper and its compounds 30-40%; Silver 10-20%; 3-Methoxy-3-methyl-1-butanol, Diethylene glycol diethyl ether,) USED FOR ATTACHING COMPONENTS | XXXXXXXXXX | 2620 | GRM | 20034.878 | Japan | NA |
| 2/21/2024 | 35069900 | 0201-003490#&ADHESIVE SX-ECA52LL (Contains Copper and its compounds 30-40%; Silver 10-20%; 3-Methoxy-3-methyl-1-butanol, Diethylene glycol diethyl ether,) USED FOR ATTACHING COMPONENTS | XXXXXXXXXX | 380 | GRM | 2905.822 | Japan | NA |