3/30/2024 | 38249999 | 0#&HVF PRE-DIP 10 chemical contains sodium hydroxide 0.035 +/- 0.025%; D-GLUCOSE : 15 +/- 5%, used for anti-oxidation cleaning in copper plating. 20l/can. 100% new | XXXXXXXXXX | 60 | LTR | 204.792 | South Korea | NA |
3/28/2024 | 3824999990 | Additive for alloy plating (Ni-P)ENF-M, used in plating industry, liquid form, 20L/can; TP: Sodium hypophosphite monohydrate 20-25%, Ammonium hydroxide Solution 15-20%, Lactic acid 10 -15%,Malic acid 5-10%#&VN | XXXXXXXXXX | 1300 | LTR | 4965.48 | VIETNAM | NA |
3/28/2024 | 3824999990 | Additive for alloy plating (Ni-P) ENF-B, used in plating industry, liquid form, 20L/can; TP: Sodium hypophosphite monohydrate 45-55%, Ammonium hydroxide Solution 1-2%. 100% new#&VN | XXXXXXXXXX | 1600 | LTR | 7151.52 | VIETNAM | NA |
3/27/2024 | 38249999 | Artificial sweat (Synthetic Sweat) 500ml/bottle (1PCS=1bottle), TP: L-Histidine hydrochloride monohydrate, Sodium chloride, Sodium dihydrogenphosphate dihydrate, used for product testing, ERP code: 71400005266VM, 100% new | XXXXXXXXXX | 1 | UNA | 30.4754 | China | NA |
3/26/2024 | 38249999 | CF 530M electrolytic nickel plated: Sodium hypophosphite monohydrate 20+/-5%, L-(+)-Lactic acid 10+/-3%, Hydroxybutanedioic acid 8+/-3%, Ammonium hydroxide 4+/-2%, Formic acid 4+/-2%,Borax 1.5+/-0.5% water (FOC) | XXXXXXXXXX | 140 | LTR | 870.8 | South Korea | NA |
3/26/2024 | 38249999 | CF 530M electrolytic nickel plated: Sodium hypophosphite monohydrate 20+/-5%, L-(+)-Lactic acid 10+/-3%, Hydroxybutanedioic acid 8+/-3%, Ammonium hydroxide 4+/-2%, Formic acid 4+/-2%, Borax 1.5+/-0.5% and water | XXXXXXXXXX | 500 | LTR | 3110 | South Korea | NA |
3/26/2024 | 38249999 | MIKO AUROMERSE V M1: Preparation for plating treatment containing the ingredients AMMONIUM CITRATE, DIBASIC (65+/-5%), DIAMMONIUM OXALATE, MONOHYDRATE (20+/-5%), CITRIC ACID MONOHYDRATE (15+/-5 %), 20kg/bag (FOC goods) | XXXXXXXXXX | 80 | KGM | 494.4 | South Korea | NA |
3/26/2024 | 38249999 | CF 530B electrolytic nickel plating: Sodium hypophosphite monohydrate 38+/-5%,Hydroxybutanedioic acid 3+/-2%,Ammonium hydroxide 2+/-1%,Formic acid 2+/-1%,Borax 0.6+/-0.2 %,Lead diacetate trihydrate0.01% water(FOC | XXXXXXXXXX | 240 | LTR | 1680 | South Korea | NA |
3/26/2024 | 38249999 | CF 530B electrolytic nickel plating: Sodium hypophosphite monohydrate 38+/-5%,Hydroxybutanedioic acid 3+/-2%,Ammonium hydroxide 2+/-1%,Formic acid 2+/-1%,Borax 0.6+/-0.2 %,Lead diacetate trihydrate 0.01%, water | XXXXXXXXXX | 800 | LTR | 5600 | South Korea | NA |
3/25/2024 | 3824999990 | HVF PRE-DIP 10 chemical contains sodium hydroxide 0.035 +/- 0.025%; D-GLUCOSE : 15 +/- 5%, used for anti-oxidation cleaning in copper plating. 20l/can. 100% new#&KR | XXXXXXXXXX | 60 | LTR | 204.792 | VIETNAM | NA |