3/30/2024 | 28353990 | Potassium pyrophosphate. (CTHH: K4P2O7. CAS: 7320-34-5, used for electroplating workshops) | XXXXXXXXXX | 500 | KGM | 5280 | Japan | NA |
3/30/2024 | 28353990 | Copper pyrophosphate (CTHH: Cu2P2O7. CAS: 15191-80-7, used for electroplating workshops) | XXXXXXXXXX | 120 | KGM | 2181.6 | Japan | NA |
3/29/2024 | 28353990 | 213#&Food additive (Sodium acid pyrophosphate) (powder) (1 carton = 25 kg, 2 cartons = 50 kg) | XXXXXXXXXX | 50 | KGM | 315 | Japan | NA |
3/28/2024 | 74061000 | CM-00068#&Copper powder for copper plating bath of CUPRIC OXIDE DC product (CuO>=90%) | XXXXXXXXXX | 1000 | KGM | 11855.7 | Japan | NA |
3/19/2024 | 28353990 | Sodium pyrophosphate powder (Na4P2O7.10H2O), used to prevent expansion and deformation of plaster molds, 500g/bottle | XXXXXXXXXX | 20 | UNA | 193.418 | Japan | NA |
3/8/2024 | 28353990 | Copper pyrophosphate (CTHH: Cu2P2O7. CAS: 15191-80-7, used for electroplating workshops) | XXXXXXXXXX | 60 | KGM | 1170 | Japan | NA |
3/8/2024 | 28353990 | Potassium pyrophosphate. (CTHH: K4P2O7. CAS: 7320-34-5, used for electroplating workshops) | XXXXXXXXXX | 300 | KGM | 3561 | Japan | NA |
3/4/2024 | 74061000 | Copper powder used for copper plating tank of product CUPRIC OXIDE DC (20KG/BAG) (CuO>=90%), 100% new product | XXXXXXXXXX | 1000 | KGM | 10766.4 | Japan | NA |
3/1/2024 | 74061000 | CM-00068#&Copper powder for copper plating bath of CUPRIC OXIDE DC product (CuO>=90%) | XXXXXXXXXX | 1000 | KGM | 11884.9 | Japan | NA |
3/1/2024 | 74061000 | CM-00068#&Copper powder for copper plating bath of CUPRIC OXIDE DC product (CuO>=90%) | XXXXXXXXXX | 1000 | KGM | 11825.8 | Japan | NA |