3/30/2024 | 38249999 | Defoamers containing less than 70% mineral oil and silicon compound, liquid form, CAS: 117272-76-1, used to produce shoe printing ink, 100% new #& KQ PTPL according to account 103621197632 ( October 28, 2020) | XXXXXXXXXX | 600 | KGM | 3900 | China | NA |
3/30/2024 | 38249999 | CHEMENPENPLA004D#&Alu Zincate adhesion agent, is a compound containing zinc salts and additives in water environments. Liquid form, packaged in 25 liters/can. New 100% | XXXXXXXXXX | 475 | LTR | 2123.1075 | Singapore | NA |
3/30/2024 | 3824999990 | KURITA S-11001 WATER TREATMENT CHEMICAL, used to treat scale in water treatment systems, TP: Organic Polymer compound 35-45%, Sodium hydroxide 20-30%, Phosphonate 10-20%,.., goods 100% new | XXXXXXXXXX | 60 | KGM | 990.33 | Thailand | NA |
3/30/2024 | 38249999 | 0#&Chemical MJH H-CUPRUM A1(Copper(II)sulfate,pentahydrate17+-5%,Sulfuric acid 3+-2%,Nickel sulfate,hexahydrate0.5+-0.4%,Cobalt(II)sulfate heptahydrate 0.09+-0.07 %.20l/can. 100% new | XXXXXXXXXX | 4340 | LTR | 16753.268 | South Korea | NA |
3/29/2024 | 3824999990 | .#&KURITA ST-1683 compound, effective in preventing scale and corrosion for industrial cooling water systems, Phosphonate 2-10% 37971-36-1, Zinc chloride 5-15% 7646-85-7, Hydrochloric acid 5-15% 7647-01-0, 100% new | XXXXXXXXXX | 40 | KGM | 300.692 | Thailand | NA |
3/29/2024 | 38249999 | MH000000099#&Metal surface treatment for printed circuit boards MECETCHBOND CZ-8401M, composition: Copper compound (5-10)%, CAS: CBI; Formic acid <5%, CAS:64-18-6. New 100%. | XXXXXXXXXX | 840 | KGM | 2143.428 | Japan | NA |
3/29/2024 | 38249999 | CR-B: Mixture of Cobalt salt and Chromium salt used in plating industry, 30kg/can, CAS code: 7732-18-5, 1344-09-8, 10049-05-5, 12125-02-9, new product 100%. | XXXXXXXXXX | 180 | KGM | 1134.414 | China | NA |
3/29/2024 | 38249999 | MH000000099#&Metal surface treatment for printed circuit boards MECETCHBOND CZ-8401M, composition: Copper compound (5-10)%, CAS: CBI; Formic acid <5%, CAS:64-18-6. New 100%. | XXXXXXXXXX | 840 | KGM | 2143.428 | Japan | NA |
3/29/2024 | 38249999 | Boilermate boiler cleaning compound SX-101V(22kg/can)TP:sodium hydroxide 1-5%(1310-73-2),sodium citrate(68-04-2),dextroseanhydrouse(50-99-7), Removes dirt in water from boiler system, 100% new | XXXXXXXXXX | 5 | UNL | 507.925 | Vietnam | NA |
3/29/2024 | 38249999 | MH000000100#&Metal surface treatment for printed circuit boards MECETCHBOND CZ-8401R, composition: Copper compound (5-10)%, CAS: CBI; Formic acid <5%, CAS:64-18-6. New 100%. | XXXXXXXXXX | 210 | KGM | 491.883 | Japan | NA |