| 1/30/2024 | 83113091 | Lead-alloy solder wire, with core containing flux, in roll form, used for soldering in electrical and electronic industries - H515/112N/F2/n/A HS1 (FLUX SOLDERS) engine mounted, 100% new)-F0001-481-00-013 | XXXXXXXXXX | 10 | Kilograms | 1225.672 | Japan | CANG CAT LAI (HCM) |
| 1/30/2024 | 83111090 | Steel electrode, coated with flux to clean the mold surface (round shape)/ Phi 2.4*150 YN24L2S, 100% new | XXXXXXXXXX | 200 | Pieces | 768 | Japan | CANG TAN VU - HP |
| 1/29/2024 | 83119000 | Y26220#&Tin soldering material in rolls (composition: Tin: 90~100%; Silver: 2.9%; Copper: 0.1~3%; Rosin: 1~10%) for automotive components/ CO FORM JV | XXXXXXXXXX | 10 | Kilograms | 833.546 | Japan | CANG TAN VU - HP |
| 1/29/2024 | 83119000 | Tin soldering material (composition: Tin: 93.1%; Silver: 2.9%; Copper: 0.5%; Rosin: 3.15%; Additive: 0.35%) used for cell components bowl/CO FORM JV/XY29630 | XXXXXXXXXX | 8 | Kilograms | 2104.7664 | Japan | CANG TAN VU - HP |
| 1/29/2024 | 83119000 | Y29630#&Tin soldering material (composition: Tin: 93.1%; Silver: 2.9%; Copper: 0.5%; Rosin: 3.15%; Additive: 0.35%) used for components of cars/CO FORM JV | XXXXXXXXXX | 40 | Kilograms | 3348.492 | Japan | CANG TAN VU - HP |
| 1/29/2024 | 83119000 | Y29630#&Tin soldering material (composition: Tin: 93.1%; Silver: 2.9%; Copper: 0.5%; Rosin: 3.15%; Additive: 0.35%) used for components of cars/CO FORM JV | XXXXXXXXXX | 8 | Kilograms | 634.3896 | Japan | CANG TAN VU - HP |
| 1/29/2024 | 83119000 | Tin soldering material (composition: Tin: 93.3%; Silver: 2.9%; Copper: 0.5%; Rosin; 2.97%; Additive: 0.33%) used for automobile components/ CO FORM JV/XY27668 | XXXXXXXXXX | 8 | Kilograms | 2092.9224 | Japan | CANG TAN VU - HP |
| 1/29/2024 | 83119000 | Y27668#&Tin soldering material (composition: Tin: 93.3%; Silver: 2.9%; Copper: 0.5%; Rosin; 2.97%; Additive: 0.33%) used for cell components bowl/CO FORM JV | XXXXXXXXXX | 56 | Kilograms | 4661.5072 | Japan | CANG TAN VU - HP |
| 1/29/2024 | 83119000 | Y27668#&Tin soldering material (composition: Tin: 93.3%; Silver: 2.9%; Copper: 0.5%; Rosin; 2.97%; Additive: 0.33%) used for cell components bowl/CO FORM JV | XXXXXXXXXX | 16 | Kilograms | 1261.6384 | Japan | CANG TAN VU - HP |
| 1/29/2024 | 83119000 | Tin soldering material in rolls (composition: Tin: 93.1%; Silver: 2.9%; Copper: 0.5%; Rosin: 3.15%; Additive: 0.35%) used for motorbike components /CO FORM JV/XY29210 | XXXXXXXXXX | 8 | Kilograms | 2105.44 | Japan | CANG DINH VU - HP |