| 3/21/2024 | 85429000 | SH634BSF0H01#&Semiconductor wafers used in semiconductor chip manufacturing technology (WAFER(FAB)); thickness 350um(+-)10um;SH634BSF0H01), WLP process, 100% new | XXXXXXXXXX | 84238 | PCE | 2105.95 | South Korea | NA |
| 3/21/2024 | 85429000 | SRG52AR20B02#&Semiconductor wafers used in semiconductor chip manufacturing technology (WAFER(FAB): SRG52AR20B02), WLP process, 100% new | XXXXXXXXXX | 293760 | PCE | 5875.2 | South Korea | NA |
| 3/21/2024 | 85429000 | KH748ARB0000#&Semiconductor wafers used in semiconductor chip manufacturing technology (WAFER(RND): KH748ARB0000), WLP process, 100% new | XXXXXXXXXX | 8444 | PCE | 227.988 | South Korea | NA |
| 3/21/2024 | 85429000 | XDG93ASZ0000#&Semiconductor wafers used in semiconductor chip manufacturing technology (WAFER(RND): | XXXXXXXXXX | 26824 | PCE | 912.016 | South Korea | NA |
| 3/21/2024 | 85429000 | SR806DX20H02#&Semiconductor wafers used in semiconductor chip manufacturing technology (WAFER(FAB)); thickness 350um(+-)10um; (SR806DX20H02), WLP process, 100% new | XXXXXXXXXX | 158194 | PCE | 5378.596 | South Korea | NA |
| 3/21/2024 | 85429000 | SWG00AR50B01#&Semiconductor wafers used in semiconductor chip manufacturing technology (WAFER(FAB): SWG00AR50B01), WLP process, 100% new | XXXXXXXXXX | 942120 | PCE | 25437.24 | South Korea | NA |
| 3/21/2024 | 85429000 | XQG47ASQ0000#&Semiconductor wafers used in semiconductor chip manufacturing technology (WAFER(RND): | XXXXXXXXXX | 209934 | PCE | 11840.2776 | South Korea | NA |
| 3/21/2024 | 85429000 | SH780AX30H02#&Semiconductor wafers used in semiconductor chip manufacturing technology (WAFER(FAB)); thickness 350um(+-)10um; SH780AX30H02), WLP process, 100% new | XXXXXXXXXX | 479887 | PCE | 11517.288 | South Korea | NA |
| 3/21/2024 | 85429000 | SD789AR50B01#&Semiconductor wafers used in semiconductor chip manufacturing technology (WAFER(FAB): SD789AR50B01), WLP process, 100% new | XXXXXXXXXX | 330048 | PCE | 17162.496 | South Korea | NA |
| 3/21/2024 | 85429000 | SH780AX30H02#&Semiconductor wafers used in semiconductor chip manufacturing technology (WAFER(FAB)); thickness 350um(+-)10um; SH780AX30H02), WLP process, 100% new | XXXXXXXXXX | 86537 | PCE | 2076.888 | South Korea | NA |