3/28/2024 | 38249999 | Preparation used in the plating industry COLMATTE Sn MAINTENANCE, is a mixture of 2-BUTOXYETHANOL and NONYLPHENOL, ETHOXYLATED, liquid, 208 liters/barrel. Cas no: 111-76-2, 9016-45-9. New 100% | XXXXXXXXXX | 416 | LTR | 1709.552 | USA | NA |
3/27/2024 | 38249999 | Surface coating: BONDERITE O-PC 253 CAN20KG (EX) (Main ingredients: Xylene - mixture of isomeres, 2-Butoxyethanol) (Inspected at TK 105354298711/A41) (1900229) (CAS 100-41-4; 98-82-8) | XXXXXXXXXX | 500 | KGM | 1400 | Thailand | NA |
3/25/2024 | 38249999 | C18709#&KL AKINI 120 Protector surface cleaner. TP: 2-Butoxyethanol 5%, Hexane, 1,6-diisocyanato-, homopolymer, Me Et ketone oxime-blocked 12%, water 83%, used for plating, 100% new product | XXXXXXXXXX | 1350 | KGM | 45814.41 | China | NA |
3/25/2024 | 38249999 | 0#&CUPRAPRO VC: Chemical preparation used in plating industry. TP: Alkohol C8-18, ethoxyliert, propoxyliert >=0.1-<1% (69013-18-9),2-Butoxyethanol >=0.1-<1%, Water >=80-<100%, 100% new | XXXXXXXXXX | 50 | KGM | 263.5 | China | NA |
3/25/2024 | 38249999 | C18770#&PERTINO SCA 422B Additive metal surface cleaner. Main ingredient: 2-Butoxyethanol 15%, water 85%, used in plating, 100% new product | XXXXXXXXXX | 50 | KGM | 899.73 | China | NA |
3/20/2024 | 38249999 | Nano substance, used to protect metal appearance, shine and prevent water absorption, liquid form, 100% new product, Part: Colloidal silica:7631-86-9,Tetraethoxysilane:78-10-4,2-Butoxyethanol :111-76-2,PVA:9002-89-5 | XXXXXXXXXX | 18 | KGM | 234 | Taiwan | NA |
3/20/2024 | 38249999 | MM04-000050#&CUPRA PRO S2 COPPER Plating ADDITIVE (CONTAINING Hydroxyacetic acid >= 3 -< 5%, 2-Butoxyethanol>= 1 -< 1.5%) USED IN THE CIRCUIT BOARD PRODUCTION PROCESS | XXXXXXXXXX | 600 | KGM | 3258 | South Korea | NA |
3/20/2024 | 38249999 | MM04-000050#&CUPRA PRO S2 COPPER Plating ADDITIVE (CONTAINING Hydroxyacetic acid >= 3 -< 5%, 2-Butoxyethanol>= 1 -< 1.5%) USED IN THE CIRCUIT BOARD PRODUCTION PROCESS | XXXXXXXXXX | 600 | KGM | 3258 | South Korea | NA |
3/20/2024 | 38249999 | 0#&CUPRAPRO VC: Chemical preparation used in plating industry. TP: Alkohol C8-18, ethoxyliert, propoxyliert >=0.1-<1% (69013-18-9),2-Butoxyethanol >=0.1-<1%, Water >=80-<100% | XXXXXXXXXX | 200 | KGM | 1054 | China | NA |
3/18/2024 | 38249999 | MM04-000050#&CUPRA PRO S2 COPPER Plating ADDITIVE (CONTAINING Hydroxyacetic acid >= 3 -< 5%, 2-Butoxyethanol>= 1 -< 1.5%) USED IN THE CIRCUIT BOARD PRODUCTION PROCESS | XXXXXXXXXX | 600 | KGM | 3258 | South Korea | NA |