Get Latest Vietnam Import Data of Butoxyethanol under HS Code 38249999

Discover latest Vietnam shipment data of Butoxyethanol under HS code 38249999. Find Product description, Price, buyer, supplier name, Port & shipping information. Ultilize these valuable insights for implementing successful marketing strategy. Scale your Business with our authentic Vietnam Import Data.


DATEHS CODEPRODUCT DESCRIPTIONEXPORTERQUANTITYUNITTOTAL VALUE USDORIGIN COUNTRYPORT OF UNLOADING
3/28/202438249999Preparation used in the plating industry COLMATTE Sn MAINTENANCE, is a mixture of 2-BUTOXYETHANOL and NONYLPHENOL, ETHOXYLATED, liquid, 208 liters/barrel. Cas no: 111-76-2, 9016-45-9. New 100%XXXXXXXXXX416LTR1709.552USANA
3/27/202438249999Surface coating: BONDERITE O-PC 253 CAN20KG (EX) (Main ingredients: Xylene - mixture of isomeres, 2-Butoxyethanol) (Inspected at TK 105354298711/A41) (1900229) (CAS 100-41-4; 98-82-8)XXXXXXXXXX500KGM1400ThailandNA
3/25/202438249999C18709#&KL AKINI 120 Protector surface cleaner. TP: 2-Butoxyethanol 5%, Hexane, 1,6-diisocyanato-, homopolymer, Me Et ketone oxime-blocked 12%, water 83%, used for plating, 100% new productXXXXXXXXXX1350KGM45814.41ChinaNA
3/25/2024382499990#&CUPRAPRO VC: Chemical preparation used in plating industry. TP: Alkohol C8-18, ethoxyliert, propoxyliert >=0.1-<1% (69013-18-9),2-Butoxyethanol >=0.1-<1%, Water >=80-<100%, 100% newXXXXXXXXXX50KGM263.5ChinaNA
3/25/202438249999C18770#&PERTINO SCA 422B Additive metal surface cleaner. Main ingredient: 2-Butoxyethanol 15%, water 85%, used in plating, 100% new productXXXXXXXXXX50KGM899.73ChinaNA
3/20/202438249999Nano substance, used to protect metal appearance, shine and prevent water absorption, liquid form, 100% new product, Part: Colloidal silica:7631-86-9,Tetraethoxysilane:78-10-4,2-Butoxyethanol :111-76-2,PVA:9002-89-5XXXXXXXXXX18KGM234TaiwanNA
3/20/202438249999MM04-000050#&CUPRA PRO S2 COPPER Plating ADDITIVE (CONTAINING Hydroxyacetic acid >= 3 -< 5%, 2-Butoxyethanol>= 1 -< 1.5%) USED IN THE CIRCUIT BOARD PRODUCTION PROCESSXXXXXXXXXX600KGM3258South KoreaNA
3/20/202438249999MM04-000050#&CUPRA PRO S2 COPPER Plating ADDITIVE (CONTAINING Hydroxyacetic acid >= 3 -< 5%, 2-Butoxyethanol>= 1 -< 1.5%) USED IN THE CIRCUIT BOARD PRODUCTION PROCESSXXXXXXXXXX600KGM3258South KoreaNA
3/20/2024382499990#&CUPRAPRO VC: Chemical preparation used in plating industry. TP: Alkohol C8-18, ethoxyliert, propoxyliert >=0.1-<1% (69013-18-9),2-Butoxyethanol >=0.1-<1%, Water >=80-<100%XXXXXXXXXX200KGM1054ChinaNA
3/18/202438249999MM04-000050#&CUPRA PRO S2 COPPER Plating ADDITIVE (CONTAINING Hydroxyacetic acid >= 3 -< 5%, 2-Butoxyethanol>= 1 -< 1.5%) USED IN THE CIRCUIT BOARD PRODUCTION PROCESSXXXXXXXXXX600KGM3258South KoreaNA

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