3/30/2024 | 35069900 | DOWSIL 3-1953 Conformal Coating, used to protect electronic circuits, main ingredients: Dimethyl siloxane, trimethoxysilyl- terminated(CAS:27858-32-8 (77%-87%), Methanol (0.068%-0.14% ), new 100% | XXXXXXXXXX | 129 | KGM | 13493.013 | USA | NA |
3/30/2024 | 35069900 | HC-1010#&Additive 1010 (cadenax), Chemical ingredients: A long chain-alkyl pendant polymer, Dimethyl sulfoxide. New 100% | XXXXXXXXXX | 30 | KGM | 3102.6 | South Korea | NA |
3/28/2024 | 35069900 | SVNL31#&U-248F ADHESIVE (MEK 17.5-22.5%, Acetone 7.5-12.5%, MA 7.5-12.5%, Ethyl acetate 14.5-19.5%, Dimethyl carbonate 27.5-32.5%, Polyurethane Resin 10.5-15.5%), QCĐG: 15KG/CAN, 100% new product | XXXXXXXXXX | 5820 | KGM | 13968 | Vietnam | NA |
3/28/2024 | 35069900 | MM900005277#&SX-ECA52LL ADHESIVE (Contains Copper and its compounds 30-40%; Silver 10-20%; 3-Methoxy-3-methyl-1-butanol, Diethylene glycol diethyl ether,) USED FOR ATTACHING COMPONENTS | XXXXXXXXXX | 1420 | GRM | 10877.768 | Japan | NA |
3/27/2024 | 35069900 | 48#&Shoe glue (455NT-1 glue (content: polyurethane resin accounts for 6.4%, acetone accounts for 0.5%, methyl actate accounts for 50%, methyl ethyl ketone accounts for 5.8%, dimethyl carbonate accounts for 37.3%), 100% new product | XXXXXXXXXX | 3210 | KGM | 6420 | Vietnam | NA |
3/26/2024 | 35069900 | 1061987001#&Binder M25-040 adhesive (TL-2421 EAC), ingredients Ethyl acetate (141-78-6) 51%, N-butanol (71-36-3) 5%, 100% new | XXXXXXXXXX | 100 | KGM | 1830.87 | Taiwan | NA |
3/26/2024 | 35069900 | 1061987001#&Binder M25-040 adhesive (TL-2421 EAC), ingredients Ethyl acetate (141-78-6) 51%, N-butanol (71-36-3) 5%, 100% new | XXXXXXXXXX | 5 | KGM | 91.54 | Taiwan | NA |
3/26/2024 | 35069900 | 3240100050#&Silicone sealant, city: Polymethyl siloxane 20-30%, Dimethyl silicone oil 3-5%, Calcium carbonate 40-45% cas 471-34-1, Aluminum hydroxide 10-15%, packaging: 1 bottle/3.8 kg, new 100% | XXXXXXXXXX | 16 | PCE | 24.2304 | China | NA |
3/25/2024 | 35069900 | K# & Glue 435NT-1 (p: polyurethane resin - 67.3%, acetone - 0.5%, methyl actate - 20%, methyl ethyl ketone - 5.8%, dimethyl carbonate - 6.4%), 100% new 100% new | XXXXXXXXXX | 16620 | KGM | 38490.258 | Vietnam | NA |
3/23/2024 | 35069900 | PWN-000004#&2900112/Adhesive used to fix components on electronic circuit boards, tp: Dimethyl Polysiloxane 50-60%, Silicon Dioxide 2%, Aluminum hydroxide 40%, Methyltrimethoxysi lane 1.5%, Silane 0.5%, 100% new | XXXXXXXXXX | 518.4 | KGM | 2099.52 | China | NA |