3/28/2024 | 38101000 | 322000503723#&Solder cream, used to solder electronic components, main ingredients: bismuth 40-50%, tin 40-50%, Rosin/Resin 1-10%, Glycol Ether 1-10%, Proprietary rosin 1-10%. .., 500g/pcs, nsx Alpha, 322000503723 | XXXXXXXXXX | 28000 | GRM | 3427.2 | China | NA |
3/27/2024 | 38101000 | Soldering paste L20-BLT5-TYPE4 500G (Bismuth 45-55%, Tin 35-45%, Rosin 1-10%, Solvent 1-10%), 100% new | XXXXXXXXXX | 2 | KGM | 185.7 | Malaysia | NA |
3/27/2024 | 38101000 | Solder paste M40-LS720 TYPE4 500G (Tin 80-90%, Bismuth 0.1-3%, Silver 0.9%, Copper 0.1-3%, Rosin 1-10%, Solvent 1-10%), 100% new | XXXXXXXXXX | 1 | KGM | 78.21 | Malaysia | NA |
3/21/2024 | 38101000 | TEV12-18#&Solder paste (ingredients: Tin, bismuth, silver, copper, rosin, solvent). New 100%. | XXXXXXXXXX | 100 | KGM | 5692 | Malaysia | NA |
3/21/2024 | 38101000 | TEV12-18#&Welding cream (ingredients: Bismuth, tin, solvent, rosin). New 100%. | XXXXXXXXXX | 2 | KGM | 149.6 | Malaysia | NA |
3/19/2024 | 38101000 | FY097#&Lead-free solder S01XBIG58-M500-4 SOLDER PASTE includes: 1.Tin 82-88% (7440-31-5), 2.Copper 0.1-1% (7440-50-8), 3. Bismuth 1-2% (7440-69-9),...),591,00068,005 | XXXXXXXXXX | 150 | KGM | 8689.5 | Japan | NA |
3/18/2024 | 38101000 | Solder paste (paste form, used for soldering, main ingredients are Tin: 75.7-78.3%; Ag:3.3-3.7%, Indium:7.5-8.5%, Bismuth:0.4-0.6%,Flux:10.5-11.5% ) LFM-70W INP, 100% new. Manufacturer: LT Materials Co.,Ltd. | XXXXXXXXXX | 60 | KGM | 10200 | Japan | NA |
3/18/2024 | 38101000 | NW266#&Lead-free solder paste D33HF (Sn42Bi58) Low Temperature Dispensing(Tin 35.69-37.4%, Bismuth 49.45-51.48%, Rosin 4.0-7.82%, Solvent 1.0-5.4 %...)911-0001- 049-V | XXXXXXXXXX | 15 | KGM | 2336.85 | China | NA |
3/14/2024 | 38101000 | RDM.046#&Solder flux 3013159:EPOP_LFM-70W INP used in the production of luminescent modules (TP: Tin-CAS:7440-31-5,Silver-CAS:7440-22-4,Indium-CAS:7440-74 -6,Bismuth-CAS:7440-69-9,FLUX) | XXXXXXXXXX | 3000 | GRM | 920.7 | South Korea | NA |
3/13/2024 | 38101000 | L20-BLT5-TYPE4#&L20-BLT5-TYPE4 Soldering Paste 500G (Bismuth 45-55%, Tin 35-45%, Rosin 1-10%, Solvent 1-10%), 100% new product (belongs to product line 1 of Account 106125528720 /C11) | XXXXXXXXXX | 2 | KGM | 339.54 | Malaysia | NA |