| 3/27/2024 | 38101000 | Soldering paste L20-BLT5-TYPE4 500G (Bismuth 45-55%, Tin 35-45%, Rosin 1-10%, Solvent 1-10%), 100% new | XXXXXXXXXX | 2 | KGM | 185.7 | Malaysia | NA |
| 3/27/2024 | 38101000 | Solder paste M40-LS720 TYPE4 500G (Tin 80-90%, Bismuth 0.1-3%, Silver 0.9%, Copper 0.1-3%, Rosin 1-10%, Solvent 1-10%), 100% new | XXXXXXXXXX | 1 | KGM | 78.21 | Malaysia | NA |
| 3/25/2024 | 29173910 | HCV022-M#&Plastic resin plasticizer (Ingredient: Tri-2-ethylhexyl trimellitate: CTHH: C33H54O6; CAS No: 3319-31-1) (100% new product) | XXXXXXXXXX | 10400 | KGM | 30160 | Malaysia | NA |
| 3/21/2024 | 38101000 | TEV12-18#&Solder paste (ingredients: Tin, bismuth, silver, copper, rosin, solvent). New 100%. | XXXXXXXXXX | 100 | KGM | 5692 | Malaysia | NA |
| 3/21/2024 | 38101000 | TEV12-18#&Welding cream (ingredients: Bismuth, tin, solvent, rosin). New 100%. | XXXXXXXXXX | 2 | KGM | 149.6 | Malaysia | NA |
| 3/13/2024 | 38101000 | L20-BLT5-TYPE4#&L20-BLT5-TYPE4 Soldering Paste 500G (Bismuth 45-55%, Tin 35-45%, Rosin 1-10%, Solvent 1-10%), 100% new product (belongs to product line 1 of Account 106125528720 /C11) | XXXXXXXXXX | 2 | KGM | 339.54 | Malaysia | NA |
| 3/13/2024 | 38101000 | L20-BLT5-TYPE4#&L20-BLT5-TYPE4 Soldering Paste 500G (Bismuth 45-55%, Tin 35-45%, Rosin 1-10%, Solvent 1-10%), 100% new product (belongs to product line 1 of Account 106125528720 /C11) | XXXXXXXXXX | 2 | KGM | 339.54 | Malaysia | NA |
| 3/11/2024 | 38109000 | Z0030#&L20-BLT5-TYPE4 Cream Solder 500G (Bismuth 45-55%, Tin 35-45%, Rosin 1-10%, Solvent 1-10%), 100% new | XXXXXXXXXX | 0.5 | KGM | 49 | Malaysia | NA |
| 3/8/2024 | 38101000 | Soldering paste L20-BLT5-TYPE4 500G (Bismuth 45-55%, Tin 35-45%, Rosin 1-10%, Solvent 1-10%), 100% new | XXXXXXXXXX | 4.5 | KGM | 427.32 | Malaysia | NA |
| 3/7/2024 | 48191000 | B-TRI-TUBE-002-.VN#&Packaging paper box - CORRUGATED BOX/CARDBOARD PACKAGE | XXXXXXXXXX | 400 | PCE | 497.92 | Malaysia | NA |