| 3/25/2024 | 35069190 | Curing agent for epoxy resin(DimeracidC18,high oleofatty acid,triethylenetetraminepolymer,Triethylenetetramine,4-(1-phenylethyl)-o-xylene,2-(1-phenylethyl)-p-xylene,Ethyl(phenylethyl)benzene)/ XY08506 | XXXXXXXXXX | 10 | KGM | 764.578 | Japan | NA |
| 3/19/2024 | 35069190 | Adhesive made from Polymer: 29-FSP792 (GLUE (SP-792)) Toluene 75% (C6H5CH3/C7H8) KH name: Methyl benzene CAS: 108-88-3, Acetone 20% (CH3COCH3/C3H6O) KH name: 2-propanone,CAS:67-64-1)-KBTC:3262/TCCN2024/GP-HC | XXXXXXXXXX | 17 | LTR | 694.5401 | Taiwan | NA |
| 3/12/2024 | 35069190 | 3000002#&Adhesive from Polymer/CHEMLOK#6108, 100% new, including Xylene 1330-20-7 65%; Ethyl benzene 100-41-4 15%; Nitrogen substituted aromatic 10%; Zinc compound 5%; Imide 5%; Carbon black 1333-86-4 5% | XXXXXXXXXX | 2160 | KGM | 39605.328 | South Korea | NA |
| 3/11/2024 | 35069190 | Curing agent for epoxy resin(DimeracidC18,high oleofatty acid,triethylenetetraminepolymer,Triethylenetetramine,4-(1-phenylethyl)-o-xylene,2-(1-phenylethyl)-p-xylene,Ethyl(phenylethyl)benzene)/ XY08506 | XXXXXXXXXX | 5 | KGM | 382.289 | Japan | NA |
| 3/11/2024 | 35069190 | Y08506#&Cutting agent for epoxy resin(DimeracidC18,high oil fatty acid,triethylenetetraminepolymer,Triethylenetetramine,4-(1-phenylethyl)-o-xylene,2-(1-phenylethyl)-p-xylene,Ethyl(phenylethyl)benzene ) | XXXXXXXXXX | 5 | KGM | 121.6375 | Japan | NA |
| 3/8/2024 | 35069190 | Chemlok 6125#&Chemlok 6125 rubber-to-metal adhesive. TPHH: xylene, ethyl benzene, Nitrogen substituted aromatic, Carbon black, Tetrachlorethylene, Toluene (below 0.9%) | XXXXXXXXXX | 18000 | GRM | 784.8 | Japan | NA |
| 3/8/2024 | 35069190 | 6108#&Chemlok 6108 rubber-to-metal adhesive. TPHH: Xylene, Ethyl benzene, Carbon black, Nitrogen substituted aromatic, Zinc compound, Imide, Toluene (below 0.9%) | XXXXXXXXXX | 18000 | GRM | 1357.2 | Japan | NA |
| 3/8/2024 | 35069190 | 6108#&Chemlok 6108 rubber-to-metal adhesive. TPHH: Xylene, Ethyl benzene, Carbon black, Nitrogen substituted aromatic, Zinc compound, Imide, Toluene (below 0.9%) | XXXXXXXXXX | 18000 | GRM | 1357.2 | Japan | NA |
| 2/29/2024 | 35069190 | 3000002#&Adhesive from Polymer/CHEMLOK#6108, 100% new, including Xylene 1330-20-7 65%; Ethyl benzene 100-41-4 15%; Nitrogen substituted aromatic 10%; Zinc compound 5%; Imide 5%; Carbon black 1333-86-4 5% | XXXXXXXXXX | 2592 | KGM | 47502.0288 | South Korea | NA |
| 2/20/2024 | 35069190 | Curing agent for epoxy resin(DimeracidC18,high oleofatty acid,triethylenetetraminepolymer,Triethylenetetramine,4-(1-phenylethyl)-o-xylene,2-(1-phenylethyl)-p-xylene,Ethyl(phenylethyl)benzene)/ XY08506 | XXXXXXXXXX | 5 | KGM | 382.289 | Japan | NA |