| 1/9/2024 | 84209110 | The steel hot rolling roller of the heat press is used to press the adhesive material to cover the substrates of the printed circuit board during the process of exposing the circuit board, Hot roller (Wet lami ): Size: phi 100 (770 mm)#&KR | XXXXXXXXXX | 2 | Pieces | 1778.64 | KR | CANG HAI AN |
| 1/9/2024 | 84209110 | The steel hot rolling roller of the heat press is used to press the adhesive material to cover the substrates of the printed circuit board during the circuit board exposure process. Hot roller (Laminating RTR (NEW)): Size: phi 80 (725 mm) #&KR | XXXXXXXXXX | 2 | Pieces | 1422.92 | KR | CANG HAI AN |
| 1/9/2024 | 84209110 | The steel hot roller of the heat press is used to press the adhesive material to cover the substrates of the printed circuit board during the process of exposing the circuit board, Hot roller (LAMI #1 - #2): Size: phi 80 (740 mm )#&KR | XXXXXXXXXX | 4 | Pieces | 2845.84 | KR | CANG HAI AN |
| 1/9/2024 | 84209110 | The steel hot roller of the heat press is used to press the adhesive material to cover the substrates of the printed circuit board during the process of exposing the circuit board, Hot roller (Wet lami ): Size: phi 80 (770 mm)#&KR | XXXXXXXXXX | 4 | Pieces | 2845.84 | KR | CANG HAI AN |
| 11/23/2023 | 84209110 | The steel hot roller of the heat press is used to press the adhesive material to cover the substrates of the printed circuit board during the process of exposing the circuit board, Hot roller (LAMI #1 - #2): Size: phi 80 (740 mm )#&KR | XXXXXXXXXX | 4 | Pieces | 2845.84 | KR | CANG TAN VU - HP |
| 11/23/2023 | 84209110 | The steel hot rolling roller of the heat press is used to press the adhesive material to cover the substrates of the printed circuit board during the process of exposing the circuit board, Hot roller (Wet lami ): Size: phi 100 (770 mm)#&KR | XXXXXXXXXX | 2 | Pieces | 1778.64 | KR | CANG TAN VU - HP |
| 11/23/2023 | 84209110 | The steel hot roller of the heat press is used to press the adhesive material to cover the substrates of the printed circuit board during the process of exposing the circuit board, Hot roller (Wet lami ): Size: phi 80 (770 mm)#&KR | XXXXXXXXXX | 6 | Pieces | 4268.76 | KR | CANG TAN VU - HP |
| 11/23/2023 | 84209110 | The steel hot rolling roller of the heat press is used to press the adhesive material to cover the substrates of the printed circuit board during the process of exposing the circuit board, Hot roller (Laminating #3,4): Size: phi 100 (745 mm) #&KR | XXXXXXXXXX | 2 | Pieces | 1778.64 | KR | CANG TAN VU - HP |
| 9/27/2023 | 84209110 | The steel hot roller of the heat press is used to press the adhesive material to cover the substrates of the printed circuit board during the process of exposing the circuit board, Hot roller (Wet lami ): Size: phi 80 (770 mm)#&KR | XXXXXXXXXX | 4 | Pieces | 2845.84 | KR | CANG XANH VIP |
| 9/27/2023 | 84209110 | The steel hot rolling roller of the heat press is used to press the adhesive material to cover the substrates of the printed circuit board during the process of exposing the circuit board, Hot roller (Laminating RTR ( NEW )): Size: phi 80 (725 mm) #&KR | XXXXXXXXXX | 2 | Pieces | 1422.92 | KR | CANG XANH VIP |