7/21/2023 | 85429000 | WDG62AX60000#&Semiconductor slice used in semiconductor chip manufacturing technology WAFER(RND) : WDG62AX60000, WLP stage, 100% new TX 1 part DH 9 TK 105473267210/E11#&KR | XXXXXXXXXX | 4916 | Pieces | 103.236 | KR | HA NOI |
7/21/2023 | 85429000 | WX806AXA0000#&Semiconductor slice used in semiconductor chip manufacturing technology WAFER(RND) : WX806AXA0000, WLP stage, 100% new TX DH 4 TK 105516808500/E11#&KR | XXXXXXXXXX | 23296 | Pieces | 1421.056 | KR | HA NOI |
7/21/2023 | 85429000 | WX707AXA0000#&Semiconductor slice used in semiconductor chip manufacturing technology WAFER(RND) : WX707AXA0000, WLP stage, 100% new TX 1 part DH 4 TK 105531514320/E11#&KR | XXXXXXXXXX | 57551 | Pieces | 3510.611 | KR | HA NOI |
7/21/2023 | 85429000 | KRG52AR20000#&Semiconductor slice used in semiconductor chip manufacturing technology WAFER(RND) : KRG52AR20000, WLP stage, 100% new TX 1 part DH 4 TK 105409038560/E11#&KR | XXXXXXXXXX | 9595 | Pieces | 311.8375 | KR | HA NOI |
7/21/2023 | 85429000 | KR881AR20000#&Semiconductor slice used in semiconductor chip manufacturing technology WAFER(RND) : KR881AR20000, WLP stage, 100% new TX 1 part DH 2 TK 105343828000/E11#&KR | XXXXXXXXXX | 32350 | Pieces | 1051.375 | KR | HA NOI |
7/21/2023 | 85429000 | WDG35ASY0000#&Semiconductor slice used in semiconductor chip manufacturing technology WAFER(RND) : WDG35ASY0000, WLP stage, 100% new TX 1 part DH 1 TK 105552449700/E11#&KR | XXXXXXXXXX | 1025 | Pieces | 34.85 | KR | HA NOI |
7/21/2023 | 85429000 | WXG35ASX0000#&Semiconductor slice used in semiconductor chip manufacturing technology WAFER(RND) : WXG35ASX0000, WLP stage, 100% new TX 1 part DH 5 TK 105545283320/E11#&KR | XXXXXXXXXX | 409 | Pieces | 19.223 | KR | HA NOI |
7/21/2023 | 85429000 | WZX26AST0000#&Semiconductor slice used in semiconductor chip manufacturing technology WAFER(RND) : WZX26AST0000, WLP stage, 100% new TX DH 2 TK 105500125250/E11#&KR | XXXXXXXXXX | 2708 | Pieces | 127.276 | KR | HA NOI |
7/21/2023 | 85429000 | KR881AR20000#&Semiconductor slice used in semiconductor chip manufacturing technology WAFER(RND) : KR881AR20000, WLP stage, 100% new TX 1 part DH 1 TK 105343828000/E11#&KR | XXXXXXXXXX | 51540 | Pieces | 1675.05 | KR | HA NOI |
7/21/2023 | 85429000 | WDG35ASY0000#&Semiconductor slice used in semiconductor chip manufacturing technology WAFER(RND) : WDG35ASY0000, WLP stage, 100% new TX DH 2 TK 105545283320/E11#&KR | XXXXXXXXXX | 9020 | Pieces | 306.68 | KR | HA NOI |