3/31/2024 | 39100090 | NPL24#&Insole 8*2.2mm (silicone material), 11116-0032461 | XXXXXXXXXX | 25100 | PCE | 193.27 | VIETNAM | NA |
3/31/2024 | 39100090 | NPL24#&Heatsink 8*8*2mm (silicone material),11116-0032475 | XXXXXXXXXX | 5000 | PCE | 49 | VIETNAM | NA |
3/30/2024 | 39100090 | 24-YCHTV-TL-8607HT-11#&PRIMARY SOLID SILICONE, SIGN TL-8607HT(11), 100% NEW#&VN | XXXXXXXXXX | 450 | KGM | 2369.25 | Hong Kong | NA |
3/30/2024 | 39100090 | 24-YCHTV-TL-8657HT#& PRIMARY SOLID SILICONE, SIGN TL-8657HT, 100% NEW#&VN | XXXXXXXXXX | 2250 | KGM | 10388.25 | Hong Kong | NA |
3/30/2024 | 39100090 | 24-YCHTV-FVM-240HTEM#& PRIMARY SOLID SILICONE, SIGN FVM-240HTEM, 100% NEW#&VN | XXXXXXXXXX | 450 | KGM | 17698.5 | Hong Kong | NA |
3/29/2024 | 39100090 | Silicone used to dissipate heat on the chip surface Liquid Silicone ESD-LTS20, 100% new | XXXXXXXXXX | 578760 | GRM | 20719.608 | VIETNAM | NA |
3/29/2024 | 39100090 | 5204-2353#&Solid primary silicon used to produce electronic components RUBBER SILICONE AS-NS70 White 70 (R400)#&KR | XXXXXXXXXX | 160 | KGM | 1617.984 | Vietnam | NA |
3/29/2024 | 39100090 | 5204-2363#&Solid primary silicon used to produce electronic components RUBBER SILICONE SW-10 White 10 (R400)#&KR | XXXXXXXXXX | 40 | KGM | 404.496 | Vietnam | NA |
3/29/2024 | 39100090 | 5204-2354#&Solid primary silicon used to produce electronic components RUBBER SILICONE AS-NS70 Graphite 70 (R400)#&KR | XXXXXXXXXX | 320 | KGM | 3271.2 | Vietnam | NA |
3/29/2024 | 39100090 | 3001#&Silicone used to dissipate heat on the chip surface Liquid Silicone ESD-LTS20, 100% new#&VN | XXXXXXXXXX | 578760 | GRM | 20719.608 | Vietnam | NA |