11/23/2023 | 28332500 | Copper Sunflate electrolytic solution used in plating lines: COPPER SULFATE SOLUTION. TP: CuSO4.5H2O 79%(7758-99-8), Potassium pyrophosphate 20%(7320-34-5). 100% new product #&KR | XXXXXXXXXX | 816.8 | Gram | 119.2528 | KR | NA |
11/16/2023 | 28332500 | Copper Sunflate electrolytic solution used in plating lines: COPPER SULFATE SOLUTION. TP: CuSO4.5H2O 79%(7758-99-8), Potassium pyrophosphate 20%(7320-34-5). 100% new product #&KR | XXXXXXXXXX | 843.9 | Gram | 123.2094 | KR | NA |
11/9/2023 | 28332500 | Copper Sunflate electrolytic solution used in plating lines: COPPER SULFATE SOLUTION. TP: CuSO4.5H2O 79%(7758-99-8), Potassium pyrophosphate 20%(7320-34-5). 100% new product #&KR | XXXXXXXXXX | 876.99 | Gram | 128.04054 | KR | NA |
11/3/2023 | 28332500 | Copper Sunflate electrolytic solution used in plating lines: COPPER SULFATE SOLUTION. TP: CuSO4.5H2O 79%(7758-99-8), Potassium pyrophosphate 20%(7320-34-5). 100% new product #&KR | XXXXXXXXXX | 386.46 | Gram | 56.42316 | KR | NA |
11/2/2023 | 28332500 | Copper Sunflate electrolytic solution used in plating lines: COPPER SULFATE SOLUTION. TP: CuSO4.5H2O 79%(7758-99-8), Potassium pyrophosphate 20%(7320-34-5). 100% new product #&KR | XXXXXXXXXX | 406.54 | Gram | 59.35484 | KR | NA |
10/26/2023 | 28332500 | Copper Sunflate electrolytic solution used in plating lines: COPPER SULFATE SOLUTION. TP: CuSO4.5H2O 79%(7758-99-8), Potassium pyrophosphate 20%(7320-34-5). 100% new product #&KR | XXXXXXXXXX | 846.5 | Gram | 123.589 | KR | NA |
10/24/2023 | 28332500 | Copper Sunflate electrolytic solution used in plating lines: COPPER SULFATE SOLUTION. TP: CuSO4.5H2O 79%(7758-99-8), Potassium pyrophosphate 20%(7320-34-5). 100% new product #&KR | XXXXXXXXXX | 861.3 | Gram | 125.7498 | KR | NA |
10/19/2023 | 28332500 | Copper Sunflate electrolytic solution used in plating lines: COPPER SULFATE SOLUTION. TP: CuSO4.5H2O 79%(7758-99-8), Potassium pyrophosphate 20%(7320-34-5). 100% new product #&KR | XXXXXXXXXX | 851.3 | Gram | 124.2898 | KR | NA |
10/12/2023 | 28332500 | Copper Sunflate electrolytic solution used in plating lines: COPPER SULFATE SOLUTION. TP: CuSO4.5H2O 79%(7758-99-8), Potassium pyrophosphate 20%(7320-34-5). 100% new product #&KR | XXXXXXXXXX | 806.05 | Gram | 117.6833 | KR | NA |
10/5/2023 | 28332500 | Copper Sunflate electrolytic solution used in plating lines: COPPER SULFATE SOLUTION. TP: CuSO4.5H2O 79%(7758-99-8), Potassium pyrophosphate 20%(7320-34-5). 100% new product #&KR | XXXXXXXXXX | 802.64 | Gram | 117.18544 | KR | NA |