Latest Vietnam Export Data of Polymerized under HS Code 38101000

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HS Code

38101000(62)

Country

DATE	HS CODE	PRODUCT DESCRIPTION	EXPORTER	QUANTITY	UNIT	TOTAL VALUE USD	DESTINATION COUNTRY	PORT OF LOADING
3/28/2024	38101000	TF232#&Solder paste TF232-M0307NI-D-885, ingredients (Solder Alloy: Sn, Cu, Ag; Paste Flux: Polymerized Rosin, Modified Rosin, PGME, HCO), used to solder circuit board components. New 100%	XXXXXXXXXX	50	KGM	2672.245	VIETNAM	NA
3/27/2024	38101000	Solder paste TF232-M0307NI-D-885, ingredients (Solder Alloy: Sn, Cu, Ag; Paste Flux: Polymerized Rosin, Modified Rosin, PGME, HCO), used to solder circuit board components. 100% new product#&VN	XXXXXXXXXX	50	KGM	2672.245	Namibia	NA
3/6/2024	38101000	TF232#&Solder paste TF232-M305NI-D-885, tp (Solder Alloy: Sn, Cu, Ag; Paste Flux: Polymerized Rosin, Modified Rosin, PGME, HCO), used to solder circuit board components. 1 pcs = 500g (1 bottle) 100% new	XXXXXXXXXX	120	PCE	4650	VIETNAM	NA
3/4/2024	38101000	TF232#&Solder paste TF232-M0307NI-D-885, ingredients (Solder Alloy: Sn, Cu, Ag; Paste Flux: Polymerized Rosin, Modified Rosin, PGME, HCO), used to solder circuit board components. New 100%	XXXXXXXXXX	100	KGM	5250.33	VIETNAM	NA
2/29/2024	38101000	Solder paste TF232-M305NI-D-885, ingredients (Solder Alloy: Sn, Cu, Ag; Paste Flux: Polymerized Rosin, Modified Rosin, PGME, HCO), used to solder circuit board components. 1 pcs = 500g (1 bottle), 100% brand new #&VN	XXXXXXXXXX	120	PCE	4661.424	Namibia	NA
2/28/2024	38101000	Solder paste TF232-M0307NI-D-885, ingredients (Solder Alloy: Sn, Cu, Ag; Paste Flux: Polymerized Rosin, Modified Rosin, PGME, HCO), used to solder circuit board components. 100% new product#&VN	XXXXXXXXXX	100	KGM	5263.23	Namibia	NA
1/17/2024	38101000	Solder paste TF232-M305NI-C-890 (55Z03000003-H00), ingredients (Solder Alloy: Sn, Cu, Ag; Paste Flux: Polymerized Rosin, Modified Rosin, PGME, HCO), used to solder circuit board components. 100% new product#&VN	XXXXXXXXXX	30	Kilograms	2558.9499	VN	NA
1/5/2024	38101000	Solder paste TF232-M305NI-C-890 (55Z03000003-H00), ingredients (Solder Alloy: Sn, Cu, Ag; Paste Flux: Polymerized Rosin, Modified Rosin, PGME, HCO), used to solder circuit board components. 100% new product#&VN	XXXXXXXXXX	40	Kilograms	3411.9332	VN	NA
1/2/2024	38101000	TF232#&Solder paste TF232-M0307NI-D-885, ingredients (Solder Alloy: Sn, Cu, Ag; Paste Flux: Polymerized Rosin, Modified Rosin, PGME, HCO), used to solder circuit board components. New 100%	XXXXXXXXXX	40	Kilograms	2157.0636	VIETNAM	NA
1/2/2024	38101000	TF232#&Solder paste TF232-M0307NI-D-885, ingredients (Solder Alloy: Sn, Cu, Ag; Paste Flux: Polymerized Rosin, Modified Rosin, PGME, HCO), used to solder circuit board components. New 100%	XXXXXXXXXX	250	Kilograms	13348.3675	VIETNAM	NA

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Exim Trade Data provides 100% genuine and the latest Export data of Polymerized underHS code 38101000 Vietnam. We collect Export data of Polymerized under HS code 38101000 with product anddate.Export data of Polymerized under HS code 38101000 Vietnam helps to analyze Export price, companyname, port, importer and exporter, product description, quantity, market trends, and many other datapoints.International Trade data of a country helps the global exporters and importers to do analysis and marketresearch to find local suppliers and buyers in that country.

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