3/28/2024 | 3824999990 | Additive for alloy plating (Ni-P) ENF-A, used in plating industry, liquid form, 20L/can; TP: Nickel sulfate hexahydrate 40-50%, Lactic acid 3-8%, Borax 3-8%#&VN | XXXXXXXXXX | 2400 | LTR | 11679.12 | Vietnam | NA |
3/28/2024 | 3824999990 | Copper plating solution supplement CU AD-1000 (1KG/CAN) (Content: thiourea 0.5%, SODIUM SACCHARIN 0.5%, Water 99%). 100% new product #&KR | XXXXXXXXXX | 10 | KGM | 399.2 | Vietnam | NA |
3/28/2024 | 3824999990 | Additive solution for copper electrolysis ELC-MPS-B (new);tp:Ethylenediaminetetraaceticacid tetrasodium salt<40%;Tetrakis(2-hydroxypropyl)-ethylenediamine<8%, water > 51%. 20 liters/barrel#&VN | XXXXXXXXXX | 200 | LTR | 491.68 | Vietnam | NA |
3/28/2024 | 3824999990 | Additive solution for copper electrolysis ELC-MPS -C, ingredients: Sodium Hydroxide (<30%), Ethylenediaminetetraaceticacid disodium salt (<2%) 20 liters/barrel#&VN | XXXXXXXXXX | 4800 | LTR | 5656.32 | Vietnam | NA |
3/28/2024 | 3824999990 | Additive for alloy plating (Ni-P)ENF-M, used in plating industry, liquid form, 20L/can; TP: Sodium hypophosphite monohydrate 20-25%, Ammonium hydroxide Solution 15-20%, Lactic acid 10 -15%,Malic acid 5-10%#&VN | XXXXXXXXXX | 1300 | LTR | 4965.48 | Vietnam | NA |
3/28/2024 | 3824999990 | Additive for alloy plating (Ni-P) ENF-C, used in plating industry, liquid form, 20L/can; TP: Sodium hydroxide 10-18%, Malic acid 2-5%, Adipic acid 5-8%, Sodium succinate dibasic 1-3%#&VN | XXXXXXXXXX | 1600 | LTR | 1761.28 | Vietnam | NA |
3/28/2024 | 3824999990 | Chemical preparation used in plating, containing anionic salt and additive TIW-200MU (Ingredient: Sodium dodecyl sulfate, Water) (20L/CAN). 100% new product #&KR | XXXXXXXXXX | 40 | LTR | 529.6 | Vietnam | NA |
3/28/2024 | 3824999990 | Cuposit (TM) 253E Electroless Copper product is an additive in electroplating, creating complexes in plating, maintaining the necessary amount of Cu ions; includes Cas: 7732-18-5 (50-60%), 64-02-8 (30-40%), Propoxylated amine(<1%); 100% new#&TW | XXXXXXXXXX | 500 | LTR | 3190 | Vietnam | NA |
3/28/2024 | 3824999990 | Additive solution for copper electrolysis ELC-MPS-B;tp:Ethylenediaminetetraaceticacid tetrasodium salt<15%;Triethanolamine<5%;Tetrakis(2-hydroxypropyl)-ethylenediamine<35%, water > 45. 20 liters/barrel#&VN | XXXXXXXXXX | 2900 | LTR | 7129.36 | Vietnam | NA |
3/28/2024 | 3824999990 | SECURIGANTH P 500 REDUCTION CONDITIONER: Chemical preparation used for plating industry (additive finishing agent); Cas: 10039-54-0 (Hydroxylamine sulfate >= 15 -< 25%); 25kg/can; 100% new#&CN | XXXXXXXXXX | 300 | KGM | 2181 | Vietnam | NA |