3/30/2024 | 85340090 | 3150528-B7#&Printed circuit board LA103WF5-SL02 (6850L-2237A), (cdsx: hardening paste, hot pressing, seamless welding, drying, air washing, bonded, packaging)#&VN | XXXXXXXXXX | 4320 | PCE | 5770.224 | South Korea | NA |
3/30/2024 | 85340090 | 3150698A003#&Printed circuit board MASS/LA103WF5-SL0B (6850L-2237B)/PI TAPE 1, (cdsx: hardening paste, hot pressing, seamless sealing, drying, air washing, bonded, packaging) #&VN | XXXXXXXXXX | 2400 | PCE | 3249.6 | South Korea | NA |
3/30/2024 | 85340090 | 3150712A001#&Printed circuit board LA123WG3-SLP1_U23 (6850L-2565A), (ccdsx: hardening paste, hot pressing, seamless sealing, drying, air washing, bonded, product packaging)#&VN | XXXXXXXXXX | 1080 | PCE | 3074.76 | South Korea | NA |
3/30/2024 | 85340090 | 3150547-B1#&Printed circuit board MASS/LA149QH1-FPC(6850L-2272A)/MARKING 1 REV B1, (cdsx: hardening paste, hot pressing, seamless welding, drying, air washing, bonded, sealing) package sp)#&VN | XXXXXXXXXX | 10496 | PCE | 4335.8976 | South Korea | NA |
3/30/2024 | 85340090 | 3150272-B2#&Printed circuit board MASS/LA103WF3-SL01(6850L-1637A)/MARKING 1 REV B2, (cdsx: hardening paste, hot pressing, seamless sealing, drying, air washing, bonded, sealing) package sp)#&VN | XXXXXXXXXX | 9000 | PCE | 1341.9 | South Korea | NA |
3/30/2024 | 85340090 | 3150500-C1#&Printed circuit board MASS/W6P-HINGE/MARKING 1 REV C1, (cdsx: hardening material paste, hot pressing, seamless connection, drying, air washing, bonded, product packaging)# &VN | XXXXXXXXXX | 26100 | PCE | 4648.41 | South Korea | NA |
3/30/2024 | 85340090 | 3150402-B1#&Printed circuit board MASS/LP140WF5-SPL1-5PJ (6850L-1992A)/MARKING 1 REV B1, (cdsx: hardening paste, hot pressing, seamless welding, drying, air washing, bonded , packaged product#&VN | XXXXXXXXXX | 26880 | PCE | 3859.968 | South Korea | NA |
3/30/2024 | 85340090 | J180011-C1#&Printed circuit board MASS/JFPCX061 (JDI W6J-CS HINGE)/MARKING 1 REV C1, (cdsx: hardening paste, hot pressing, seamless sealing, drying, air washing, bonded, sealing) package sp)#&VN | XXXXXXXXXX | 27000 | PCE | 5221.8 | South Korea | NA |
3/30/2024 | 85340090 | 3150545-B4#&Printed circuit board LA080WH1-SL01 (6850L-2273A), (cdsx: hardening paste, hot pressing, seamless sealing, drying, air washing, bonded, packaging)#&VN | XXXXXXXXXX | 5238 | PCE | 9058.0734 | South Korea | NA |
3/29/2024 | 85340090 | 3150272-B2#&Printed circuit board MASS/LA103WF3-SL01(6850L-1637A)/MARKING 1 REV B2, (cdsx: hardening paste, hot pressing, seamless sealing, drying, air washing, bonded, sealing) package sp)#&VN | XXXXXXXXXX | 7800 | PCE | 1162.98 | South Korea | NA |