3/28/2024 | 3824999990 | Additive for alloy plating (Ni-P) ENF-A, used in plating industry, liquid form, 20L/can; TP: Nickel sulfate hexahydrate 40-50%, Lactic acid 3-8%, Borax 3-8%#&VN | XXXXXXXXXX | 2400 | LTR | 11679.12 | Vietnam | NA |
3/25/2024 | 3824999990 | HVF EL-CU M H2: Copper plating additive contains Sodium hydroxide 10+/-2%, nickel sulfate, hexahydrate 0.5+/-0.4%, the rest is water. 20l/can. 100% new#&KR | XXXXXXXXXX | 640 | LTR | 2990.656 | Vietnam | NA |
3/25/2024 | 3824999990 | Copper plating additive HVF EL-CU A H1 contains Sulfuric Acid 3+/- 2%, Copper(II) sulfate 15 +/-5%, nickel sulfate, hexahydrate <1%, the remainder is water. 20L/can. 100% new product #&KR | XXXXXXXXXX | 940 | LTR | 2769.24 | Vietnam | NA |
3/11/2024 | 3824999990 | .#&Additive for alloy plating (Ni-P) ENF-A, used in plating industry, liquid form, 20L/can; TP: Nickel sulfate hexahydrate 40-50%, Lactic acid 3-8%, Borax 3-8%#&VN | XXXXXXXXXX | 800 | LTR | 3905.76 | VIETNAM | NA |
2/27/2024 | 3824999990 | Additive for alloy plating (Ni-P) ENF-A, used in plating industry, liquid form, 20L/can; TP: Nickel sulfate hexahydrate 40-50%, Lactic acid 3-8%, Borax 3-8%#&VN | XXXXXXXXXX | 800 | LTR | 3923.36 | Vietnam | NA |
2/26/2024 | 3824999990 | HVF EL-CU M H2: Copper plating additive contains Sodium hydroxide 10+/-2%, nickel sulfate, hexahydrate 0.5+/-0.4%, the rest is water. 20l/can. 100% new#&KR | XXXXXXXXXX | 640 | LTR | 3013.952 | Vietnam | NA |
2/26/2024 | 3824999990 | Copper plating additive HVF EL-CU A H1 contains Sulfuric Acid 3+/- 2%, Copper(II) sulfate 15 +/-5%, nickel sulfate, hexahydrate <1%, the remainder is water. 20L/can. 100% new product #&KR | XXXXXXXXXX | 940 | LTR | 2790.766 | Vietnam | NA |
2/21/2024 | 3824999990 | .#&Additive for alloy plating (Ni-P) ENF-A, used in plating industry, liquid form, 20L/can; TP: Nickel sulfate hexahydrate 40-50%, Lactic acid 3-8%, Borax 3-8% | XXXXXXXXXX | 1800 | LTR | 8882.1 | VIETNAM | NA |
1/30/2024 | 3824999990 | Additive for alloy plating (Ni-P) ENF-A, used in plating industry, liquid form, 20L/can; TP: Nickel sulfate hexahydrate 40-50%, Lactic acid 3-8%, Borax 3-8%#&VN | XXXXXXXXXX | 1800 | Liter | 8840.178 | VN | NA |
1/25/2024 | 3824999990 | Copper plating additive HVF EL-CU A H1 contains Sulfuric Acid 3+/- 2%, Copper(II) sulfate 15 +/-5%, nickel sulfate, hexahydrate <1%, the remainder is water. 20L/can. 100% new product #&KR | XXXXXXXXXX | 2560 | Liter | 7611.2128 | VN | NA |