| 3/14/2024 | 38249999 | XTP-M electrostatically plated HC has tp: Ethylenediamine <8% (Cas: 107-15-3); Ethylenediaminetetraacetic acid <7% ( Cas : 60-00-4 ) Hydrochloric acid <4% ( Cas : 7647-01-0 ) and water (remaining). 100% new#&JP | XXXXXXXXXX | 300 | LTR | 11934 | Vietnam | NA |
| 12/21/2023 | 38249999 | XTP-M electrostatically plated HC has tp: Ethylenediamine <8% (Cas: 107-15-3); Ethylenediaminetetraacetic acid <7% ( Cas : 60-00-4 ) Hydrochloric acid <4% ( Cas : 7647-01-0 ) and water (remaining). 100% new#&JP | XXXXXXXXXX | 300 | Liter | 11934 | VN | NA |
| 11/17/2023 | 38249999 | XTP-M electrostatically plated HC has tp: Ethylenediamine <8% (Cas: 107-15-3); Ethylenediaminetetraacetic acid <7% ( Cas : 60-00-4 ) Hydrochloric acid <4% ( Cas : 7647-01-0 ) and water (remaining). 100% new#&JP | XXXXXXXXXX | 300 | Liter | 11934 | VN | NA |
| 10/12/2023 | 38249999 | XTP-M electrostatically plated HC has tp: Ethylenediamine <8% (Cas: 107-15-3); Ethylenediaminetetraacetic acid <7% ( Cas : 60-00-4 ) Hydrochloric acid <4% ( Cas : 7647-01-0 ) and water (remaining). 100% new#&JP | XXXXXXXXXX | 500 | Liter | 19890 | VN | NA |
| 7/3/2023 | 38249999 | XTP-M electroplating HC has the following composition: Ethylenediamine <8% (Cas: 107-15-3); Ethylenediaminetetraacetic acid < 7% (Cas : 60-00-4) Hydrochloric acid < 4% (Cas : 7647-01-0) and water (remaining), 100% new.#&JP | XXXXXXXXXX | 600 | Liter | 23868 | VN | NA |
| 6/13/2023 | 38249999 | XTP-M electroplating HC has tp: Ethylenediamine <8% (Cas: 107-15-3); Ethylenediaminetetraacetic acid <7% (Cas: 60-00-4) Hydrochloric acid <4% (Cas: 7647-01-0) and water (remaining). 100% New#&JP | XXXXXXXXXX | 400 | Liter | 15912 | VN | NA |