3/28/2024 | 3824999990 | The chemical product is a mixture of sodium and copper salts used in electroplating CUPRACID ULTRA B (25Kg/Can)( bis-(3-sulfopropyl)-disulfide, disodium salt, copper sulphate). 100% brand new #&CN | XXXXXXXXXX | 75 | KGM | 827.25 | Vietnam | NA |
3/28/2024 | 3824999990 | Chemical preparations used in electroplating technology CUPRACID ULTRA MAKE-UP (25Kg/Can)(sulphuric acid <3%, Copper Sulfate, bis-(3-sulfopropyl)-disulfide, disodium salt). 100% new product #&CN | XXXXXXXXXX | 100 | KGM | 1019 | Vietnam | NA |
3/28/2024 | 3824999990 | Cuposit (TM) 253E Electroless Copper product is an additive in electroplating, creating complexes in plating, maintaining the necessary amount of Cu ions; includes Cas: 7732-18-5 (50-60%), 64-02-8 (30-40%), Propoxylated amine(<1%); 100% new#&TW | XXXXXXXXXX | 500 | LTR | 3190 | Vietnam | NA |
3/28/2024 | 3824999990 | Chemical preparations used in electroplating technology CUPRACID ULTRA A (25Kg/Can)(sulphuricacid,bis(N-(7-hydroxy-8-methyl-5-phenylphenazine-3-ylidene)dimethylammonium)sulfate).New product 100 %#&CN | XXXXXXXXXX | 75 | KGM | 1308.75 | Vietnam | NA |
3/26/2024 | 3824999990 | BONDFILM PART A PLUS 65: Chemical preparations for electroplating (1,2,3-Benzotriazole >=13-<15%;Sulfuric acid >=10-<13%;heterocyclic base - amine >=1-<1.5 %),(25kg/can; Cas: 95-14-7,7664-93-9); 100% new#&CN | XXXXXXXXXX | 800 | KGM | 6448 | Vietnam | NA |
3/26/2024 | 3824999990 | Copper Gleam (TM) product ST-901BM (J) is an additive in electroplating, preventing copper from plating on the convex surface of the circuit board, including Cas: 7732-18-5 (80-90%), Oxyalkylene Polymer ( 1-10%),7758-98-7(0.1-1%),7664-93-9(<1%)#&JP | XXXXXXXXXX | 1400 | LTR | 16422 | Vietnam | NA |
3/22/2024 | 3824999990 | BONDFILM PART A PLUS 65: Chemical preparations for electroplating (1,2,3-Benzotriazole >=13-<15%;Sulfuric acid >=10-<13%;heterocyclic base - amine >=1-<1.5 %),(25kg/can; Cas: 95-14-7,7664-93-9); 100% new#&CN | XXXXXXXXXX | 1500 | KGM | 12090 | Vietnam | NA |
3/22/2024 | 3824999990 | R2004006-001615#&Preparations used in plating, electroplating chemicals, other finishing substances, the main ingredient is a mixture of acetate salt, sulphate of Nickel, sodium, additive TOP SEAL H-298(L).(20 LTR/ UNL).100% New#&JP | XXXXXXXXXX | 120 | LTR | 518.4 | Vietnam | NA |
3/22/2024 | 3824999990 | R2004006-001615#&Preparations used in plating, electroplating chemicals, other finishing substances, the main ingredient is a mixture of acetate salt, sulphate of Nickel, sodium, additive TOP SEAL H-298(L).(20 LTR/ UNL).100% New#&JP | XXXXXXXXXX | 11320 | LTR | 62260 | Vietnam | NA |
3/22/2024 | 3824999990 | Chemical YSP-250 used in electroplating industry (components N-propyl alcohol 71-23-8 12%; Sulfuric acid 3%; N-(2-chloro-4-pyridyl)-Nphenylurea 68157-60-8 1% ),Manufacturer: Yushin Technopia Co.,ltd (Korea), 100% new#&KR | XXXXXXXXXX | 640 | KGM | 1771.52 | Vietnam | NA |