3/26/2024 | 34039919 | Cutting oil used in cutting silicon wafers with diamond wire, ingredients: Dispersant 35% (9003-11-6); Wetting agent 15% (9002-92-0); Lubricant 10% (68131-39-5); 40% water, 100% new#&CN | XXXXXXXXXX | 2000 | KGM | 8860 | Vietnam | NA |
3/21/2024 | 34039919 | Cutting oil used in cutting silicon wafers with diamond wire, ingredients: Dispersant 35% (9003-11-6); Wetting agent 15% (9002-92-0); Lubricant 10% (68131-39-5); 40% water, 100% new#&CN | XXXXXXXXXX | 28000 | KGM | 124040 | Vietnam | NA |
3/6/2024 | 34039919 | Cutting oil used in cutting silicon wafers with diamond wire, ingredients: Dispersant 35% (9003-11-6); Wetting agent 15% (9002-92-0); Lubricant 10% (68131-39-5); 40% water, 100% new#&CN | XXXXXXXXXX | 2000 | KGM | 8860 | Vietnam | NA |
2/22/2024 | 34039919 | Cutting oil used in cutting silicon wafers with diamond wire, ingredients: Dispersant 35% (9003-11-6); Wetting agent 15% (9002-92-0); Lubricant 10% (68131-39-5); 40% water, 100% new#&CN | XXXXXXXXXX | 28000 | KGM | 124040 | Vietnam | NA |
2/15/2024 | 34039919 | Cutting oil used in cutting silicon wafers with diamond wire, ingredients: Dispersant 35% (9003-11-6); Wetting agent 15% (9002-92-0); Lubricant 10% (68131-39-5); 40% water, 100% new#&CN | XXXXXXXXXX | 30000 | KGM | 132900 | Vietnam | NA |
2/2/2024 | 34039919 | Cutting oil used in cutting silicon wafers with diamond wire, ingredients: Dispersant 35% (9003-11-6); Wetting agent 15% (9002-92-0); Lubricant 10% (68131-39-5); 40% water, 100% new#&CN | XXXXXXXXXX | 30000 | KGM | 132900 | Vietnam | NA |
2/1/2024 | 34039919 | Cutting oil used in cutting silicon wafers with diamond wire, ingredients: Dispersant 35% (9003-11-6); Wetting agent 15% (9002-92-0); Lubricant 10% (68131-39-5); 40% water, 100% new#&CN | XXXXXXXXXX | 2000 | KGM | 8860 | Vietnam | NA |
1/26/2024 | 34039919 | Cutting oil used in cutting silicon wafers with diamond wire, ingredients: Dispersant 35% (9003-11-6); Wetting agent 15% (9002-92-0); Lubricant 10% (68131-39-5); 40% water, 100% new#&CN | XXXXXXXXXX | 28000 | Kilograms | 124040 | VN | NA |
1/12/2024 | 34039919 | Cutting oil used in cutting silicon wafers with diamond wire, ingredients: Dispersant 35% (9003-11-6); Wetting agent 15% (9002-92-0); Lubricant 10% (68131-39-5); 40% water, 100% new#&CN | XXXXXXXXXX | 2000 | Kilograms | 8860 | VN | NA |
1/10/2024 | 34039919 | Cutting oil used in cutting silicon wafers with diamond wire, ingredients: Dispersant 35% (9003-11-6); Wetting agent 15% (9002-92-0); Lubricant 10% (68131-39-5); 40% water, 100% new#&CN | XXXXXXXXXX | 28000 | Kilograms | 124040 | VN | NA |