| 11/15/2023 | 35069900 | Glue H907-B (W00105), (1kg/bottle), used to glue electronic components. TP: Epoxy 45%, Dicyandiamide 25%, silicon powder 20%, diluent 10%. 100% new product #&CN | XXXXXXXXXX | 44 | Kilograms | 351.12 | VN | NA |
| 9/15/2023 | 35069900 | Glue H907-B (W00105), (1kg/bottle), used to glue electronic components. TP: Epoxy 45%, Dicyandiamide 25%, silicon powder 20%, diluent 10%. 100% new product #&CN | XXXXXXXXXX | 9 | Kilograms | 72.54 | VN | NA |