| 1/18/2024 | 38109000 | 0#&Chemical SD-360SP (Sulfuric acid 12-16%(7664-93-9), Hydrogen peroxide 3-8%(7722-84-1),Butylamine,Acetone,Additive less than 1%,Water 73-82% ) used to clean metal surfaces during the PCB circuit board plating process | XXXXXXXXXX | 300 | Kilograms | 474.882 | VIETNAM | NA |
| 1/17/2024 | 38109000 | Chemical SD-360SP (Sulfuric acid 12-16%, Hydrogen peroxide 3-8%, Butylamine, Acetone, Additive less than 1% Water 73-82%) used to clean metal surfaces during the PCB plating process, 20kg /can.100% new item#&VN | XXXXXXXXXX | 300 | Kilograms | 474.882 | VN | NA |
| 12/30/2023 | 38109000 | 0#&Chemical SD-360SP (Sulfuric acid 12-16%(7664-93-9), Hydrogen peroxide 3-8%(7722-84-1),Butylamine,Acetone,Additive less than 1%,Water 73-82% ) used to clean metal surfaces during the PCB circuit board plating process | XXXXXXXXXX | 400 | Kilograms | 641 | VIETNAM | NA |
| 12/30/2023 | 38109000 | 0#&Chemical SD-360SP (Sulfuric acid 12-16%(7664-93-9), Hydrogen peroxide 3-8%(7722-84-1),Butylamine,Acetone,Additive less than 1%,Water 73-82% ) used to clean metal surfaces during the PCB circuit board plating process | XXXXXXXXXX | 400 | Kilograms | 641 | VIETNAM | NA |
| 12/26/2023 | 38109000 | Chemical SD-360SP (Sulfuric acid 12-16%, Hydrogen peroxide 3-8%, Butylamine, Acetone, Additive less than 1% Water 73-82%) used to clean metal surfaces during the PCB plating process, 20kg /can.100% new item#&VN | XXXXXXXXXX | 400 | Kilograms | 641.196 | VN | NA |
| 12/15/2023 | 38109000 | 0#&Chemical SD-360SP (Sulfuric acid 12-16%(7664-93-9), Hydrogen peroxide 3-8%(7722-84-1),Butylamine,Acetone,Additive less than 1%,Water 73-82% ) used to clean metal surfaces during the PCB circuit board plating process | XXXXXXXXXX | 1280 | Kilograms | 2051 | VIETNAM | NA |
| 12/15/2023 | 38109000 | 0#&Chemical SD-360SP (Sulfuric acid 12-16%(7664-93-9), Hydrogen peroxide 3-8%(7722-84-1),Butylamine,Acetone,Additive less than 1%,Water 73-82% ) used to clean metal surfaces during the PCB circuit board plating process | XXXXXXXXXX | 1280 | Kilograms | 2051 | VIETNAM | NA |
| 12/13/2023 | 38109000 | Chemical SD-360SP (Sulfuric acid 12-16%, Hydrogen peroxide 3-8%, Butylamine, Acetone, Additive less than 1% Water 73-82%) used to clean metal surfaces during the PCB plating process, 20kg /can.100% new item#&VN | XXXXXXXXXX | 1280 | Kilograms | 2051.8272 | VN | NA |
| 11/27/2023 | 38109000 | Chemical SD-360SP (Sulfuric acid 12-16%, Hydrogen peroxide 3-8%, Butylamine, Acetone, Additive less than 1% Water 73-82%) used to clean metal surfaces during the PCB plating process, 20kg /can.100% new item#&VN | XXXXXXXXXX | 300 | Kilograms | 480.198 | VN | NA |
| 11/20/2023 | 38109000 | 0#&Chemical SD-360SP (Sulfuric acid 12-16%(7664-93-9), Hydrogen peroxide 3-8%(7722-84-1),Butylamine,Acetone,Additive less than 1%,Water 73-82% ) used to clean metal surfaces during the PCB circuit board plating process | XXXXXXXXXX | 800 | Kilograms | 1280.528 | VIETNAM | NA |