| 3/27/2024 | 8002000010 | WASTE SOLDER PASTE- Tin scrap obtained from the solder paste printing stage during the production of electronic circuit boards (Tin scrap)#&VN | XXXXXXXXXX | 21.75 | KGM | 506.4705 | Japan | NA |
| 3/25/2024 | 8002000090 | Soldering tin scraps (Solder tin scraps recovered from the component welding process during the production and production support process. The percentage of remaining impurities does not exceed 5% of the volume)#&VN | XXXXXXXXXX | 311.2 | KGM | 2968.848 | Japan | NA |
| 3/23/2024 | 8002000090 | Soldering tin scraps (Solder tin scraps recovered from the component welding process during the production and production support process. The percentage of remaining impurities does not exceed 5% of the volume)#&VN | XXXXXXXXXX | 578 | KGM | 5514.12 | Japan | NA |
| 3/23/2024 | 8002000090 | Soldering tin scraps (Solder tin scraps recovered from the component welding process during the production and production support process. The percentage of remaining impurities does not exceed 5% of the volume) #&VN | XXXXXXXXXX | 244.2 | KGM | 2329.668 | Japan | NA |
| 3/20/2024 | 8002000090 | #&Tin scrap scrap Tin scrap (from the process of soldering tin components of diodes, capacitors, fuses, etc.) obtained from the production process, the impurity rate is not more than 5% volume)#&KXD | XXXXXXXXXX | 260.5 | KGM | 2894.155 | Japan | NA |
| 2/22/2024 | 8002000090 | Soldering tin scraps (Solder tin scraps recovered from the component welding process during the production and production support process. The percentage of remaining impurities does not exceed 5% of the volume)#&VN | XXXXXXXXXX | 189 | KGM | 1803.06 | Japan | NA |