| 12/12/2023 | 3810100000 | SOLDER PASTE. CONTAINS TIN 62%, LEAD 36%, MODIFIED ROSSIN 2%, DESIGNED FOR SOLDERING ELECTRONIC COMPONENTS ON PRINTED BOARDS, FOR USE IN THE RADIO ELECTRONICS INDUSTRY | XXXXXXXXXX | 0 | N/A | 1355 | China | SAINT PETERSBURG |
| 12/6/2023 | 3810100000 | SOLDERING PASTES: SOLDERING PASTE CONTAINS TIN, LEAD, SILVER (1%), ROSSIN. CAS No. 65997-05-9, DESIGNED FOR SOLDERING ELECTRONIC COMPONENTS ON PRINTED BOARDS, FOR APPLICATION IN THE RADIO ELECTRONICS INDUSTRY | XXXXXXXXXX | 0 | N/A | 3155 | China | SHENZHEN |
| 12/4/2023 | 3810100000 | SOLDER PASTES SN62PB36AG2. DESIGNED FOR SOLDERING VARIOUS PARTS OF PRINTED BOARDS TOGETHER. PACKED IN PLASTIC JARS OF 500 G EACH. | XXXXXXXXXX | 0 | N/A | 6757 | China | SHENZHEN |
| 12/3/2023 | 3810100000 | PASTES FOR LOW TEMPERATURE SOLDERING, CONSISTING OF METAL AND AUXILIARY MATERIALS (FLUX). USED IN THE ELECTRONICS INDUSTRY FOR SOLDERING PRINTED BOARDS AND MICROCIRCUITS. IN POLYMER CANS OF 500 GR, NOT FOR MILITARY PURPOSE. | XXXXXXXXXX | 0 | N/A | 4126 | China | SHENZHEN |
| 11/27/2023 | 3810100000 | SOLDER PASTE, INTENDED FOR SOLDERING ELECTRONIC COMPONENTS ON PRINTED BOARDS, FOR USE IN RADIO ELECTRONICS INDUSTRY PRODUCTIONS, CONTAINS TIN 62%, LEAD 36%. MODIFIED ROSSIN 0.1% AND SILVER 1.9% CONTAINS TIN 62%, LEAD 36%, MODIFIED ROSSIN 0.1% AND SILVER 1 | XXXXXXXXXX | 0 | N/A | 6644 | China | SAINT PETERSBURG |
| 11/24/2023 | 3810100000 | SOLDER PASTE. DESIGNED FOR AUTOMATIC SCREEN APPLICATION ON PRINTED CIRCUIT BOARDS, WITHOUT CONTENT OF PRECURSORS, WITHOUT CONTENT OF NARCOTIC AND PSYCHOTROPIC SUBSTANCES, WITHOUT CONTENT OF TOXIC SUBSTANCES, FOR GENERAL CIVIL APPLICATION: | XXXXXXXXXX | 0 | N/A | 6636 | United Kingdom | ISTANBUL |
| 11/17/2023 | 3810100000 | SOLDERING PASTES. COMPOSITION: TIN 60%. LEAD 30%, MODIFIED ROSSIN 10%. INTENDED FOR USE WHEN INSTALLING SMD COMPONENTS IN THE PRODUCTION OF PRINTED BOARDS. | XXXXXXXXXX | 0 | N/A | 25269 | China | HUIZHOU |
| 11/2/2023 | 3810100000 | SOLDER PASTE CONTAINS TIN 62%, LEAD 36%, MODIFIED ROSSIN 2%. DESIGNED FOR SOLDERING ELECTRONIC COMPONENTS ON PRINTED BOARDS FOR APPLICATION IN RADIO ELECTRONICS INDUSTRY | XXXXXXXXXX | 0 | N/A | 335 | China | MOSCOW |