12/18/2023 | 8473302008 | PRINTED BOARD ASSEMBLY FOR PROCESSOR MODULE PM03CAM_C, DESIGNED FOR USAGE | XXXXXXXXXX | 0 | N/A | 3738 | China | SHENZHEN |
12/18/2023 | 8473302008 | ELECTRONIC MODULE FOR COMPLETING COMPUTER EQUIPMENT - PROCESSOR (MA | XXXXXXXXXX | 0 | N/A | 4434 | China | SAINT PETERSBURG |
12/18/2023 | 8473302008 | PROCESSOR ELECTRONIC MODULE IN THE FORM OF A BOARD WITH COMPONENTS | XXXXXXXXXX | 0 | N/A | 10890 | China | MOSCOW |
12/18/2023 | 8473302008 | PROCESSOR ELECTRONIC MODULE IN THE FORM OF A BOARD WITH COMPONENTS | XXXXXXXXXX | 0 | N/A | 364 | China | MOSCOW |
12/18/2023 | 8473302008 | BUILT-IN RAM MEMORY MODULE, ON | XXXXXXXXXX | 0 | N/A | 1037 | China | MOSCOW |
12/18/2023 | 8473302008 | BUILT-IN RAM MEMORY MODULE, ON | XXXXXXXXXX | 0 | N/A | 1037 | China | MOSCOW |
12/18/2023 | 8473302008 | PROCESSOR ELECTRONIC MODULE IN THE FORM OF A BOARD WITH COMPONENTS | XXXXXXXXXX | 0 | N/A | 430 | China | MOSCOW |
12/18/2023 | 8473302008 | PROCESSOR ELECTRONIC MODULE IN THE FORM OF A BOARD WITH COMPONENTS | XXXXXXXXXX | 0 | N/A | 364 | China | MOSCOW |
12/17/2023 | 8473302008 | ELECTRONIC MODULE - RAM FOR ASSEMBLY AND UPGRADES | XXXXXXXXXX | 0 | N/A | 378423 | China | HONG KONG |
12/17/2023 | 8473302008 | ELECTRONIC MODULE - RAM FOR ASSEMBLY AND UPGRADES | XXXXXXXXXX | 0 | N/A | 378423 | China | HONG KONG |