| 12/12/2023 | 8541600000 | COLLECTED PIEZOELECTRIC CRYSTALS. CHIP COMPONENT FOR INSTALLATION ON A PRINTED BOARD. ELECTRONIC CIRCUIT DEVICE FOR INDUSTRIAL EQUIPMENT. NOT FOR MILITARY PURPOSE. NOT NUCLEAR ENGINEERING, NOT ELECTRICAL EQUIPMENT SCRAP; | XXXXXXXXXX | 45 | N/A | 91 | United States | SHENZHEN | 
| 12/5/2023 | 8541100009 | DIODE. SEMICONDUCTOR ELEMENT OF AN ELECTRIC CIRCUIT, (NOT A PHOTODIOD, NOT LIGHT EMISSIONING). CHIP COMPONENT FOR SURFACE MOUNTING (SMD) ON A PRINTED BOARD, CIRCUIT DEVICE, FOR AUTOMATION SYSTEMS OF INDUSTRIAL EQUIPMENT. NOT FOR MILITARY PURPOSE; | XXXXXXXXXX | 360 | N/A | 72 | United States | SHENZHEN | 
| 12/5/2023 | 8541100009 | DIODES. NOT SCRAP ELECTRICAL EQUIPMENT | XXXXXXXXXX | 9916 | N/A | 1067 | United States | SHENZHEN | 
| 12/5/2023 | 8541600000 | COLLECTED PIEZOELECTRIC CRYSTALS. CHIP COMPONENT FOR INSTALLATION ON A PRINTED BOARD. ELECTRONIC CIRCUIT DEVICE FOR INDUSTRIAL EQUIPMENT. NOT FOR MILITARY PURPOSE, NOT NUCLEAR EQUIPMENT. NOT SCRAP OF ELECTRICAL EQUIPMENT; | XXXXXXXXXX | 45 | N/A | 152 | United States | SHENZHEN | 
| 12/5/2023 | 8541290000 | TRANSISTORS. NOT SCRAP ELECTRICAL EQUIPMENT | XXXXXXXXXX | 4526 | N/A | 4211 | United States | SHENZHEN | 
| 12/5/2023 | 8541490000 | PHOTOSENSITIVE SEMICONDUCTOR DEVICES ASSEMBLED IN A MODULE (PACKAGE) WITH SURFACE MOUNTING (SDM) TEADS ON A PRINTED BOARD. CIRCUIT DEVICE FOR INDUSTRIAL EQUIPMENT AUTOMATION SYSTEMS. NOT FOR MILITARY PURPOSE; | XXXXXXXXXX | 100 | N/A | 21 | United States | SHENZHEN | 
| 12/1/2023 | 8541100009 | DIODES. THEY ARE USED IN INDUSTRIAL ELECTRONICS AND AUTOMATION AS COMPONENTS. OPERATING VOLTAGE UP TO 1000V. NOT ELECTRONIC EQUIPMENT SCRAP, | XXXXXXXXXX | 300 | N/A | 23 | United States | SHENZHEN CHINA | 
| 11/30/2023 | 8541600000 | COLLECTED PIEZOELECTRIC CRYSTALS. USED IN THE PRODUCTION OF DIGITAL RADIO ELECTRONIC DEVICES AS AN ELEMENT OF FREQUENCY STABILIZATION, NOT SCRAP OF ELECTRICAL EQUIPMENT: | XXXXXXXXXX | 150 | N/A | 2890 | United Kingdom | SHENZHEN | 
| 11/29/2023 | 8541490000 | SEMICONDUCTOR PHOTOSENSITIVE DEVICES, NOT SCRAP OF ELECTRICAL EQUIPMENT: | XXXXXXXXXX | 350 | N/A | 2931 | United States | SHENZHEN | 
| 11/28/2023 | 8541100009 | SEMICONDUCTOR DIODES, NOT ASSEMBLED INTO A MODULE, NOT MOUNTED INTO A PANEL. USED IN ELECTRONIC DEVICES FOR GENERAL CIVIL PURPOSE (NOT SCRAP ELECTRICAL EQUIPMENT, NOT HIGH VOLTAGE EQUIPMENT, ARE NOT PHOTODIODES AND LIGHT EMITTING DIODES (LED)) | XXXXXXXXXX | 15000 | N/A | 452 | United States | SHENZHEN |