| 11/1/2023 | 3810100000 | PASTES FOR LOW TEMPERATURE SOLDERING: LEAD-FREE SOLDER PASTE KOKI S3X58-M406-3, FOR SCREEN PRINTING OF VARIOUS UNITS AND BLOCKS OF RADIO ELECTRONIC EQUIPMENT AND MICROELECTRONICS PRODUCTS. IT IS A FINISHED PRODUCT IN THE FORM OF A DISPERSION. CONSISTED OF POWDER SOLDER (COMPOSITION,%) SN96.5 AG3.0 CU0.5 WITH PARTICLE SIZE 20 ~ 38 MICROMETERS (MICRONS) AND FLUX BINDING - 11.5%, ROL0 (WEAKLY ACTIVE, DOES NOT REQUIRE WASHING) AND 2-(2 -HEXYLOXYETOXY) ETHANOL (DIETHYLENE GLYCOL HEXYL ETHER) - 3-5% | XXXXXXXXXX | 0 | N/A | 50761 | Poland | NOVOROSSIYSK |