| 12/16/2023 | 8532240000 | CERAMIC MULTILAYER CHIP CAPACITORS, FOR SURFACE | XXXXXXXXXX | 0 | N/A | 21 | United States | ШЕНЬЧЖЕНЬ |
| 12/16/2023 | 8532240000 | CERAMIC MULTILAYER CHIP CAPACITORS, FOR SURFACE | XXXXXXXXXX | 0 | N/A | 21 | United States | ШЕНЬЧЖЕНЬ |
| 12/12/2023 | 8542339000 | MONOLITHIC INTEGRAL CIRCUIT. AMPLIFIERS. CHIP COMPONENT DL | XXXXXXXXXX | 360 | N/A | 24745 | United States | SHENZHEN |
| 12/12/2023 | 8541600000 | COLLECTED PIEZOELECTRIC CRYSTALS. CHIP COMPONENT FOR INSTALLATION H | XXXXXXXXXX | 45 | N/A | 91 | United States | SHENZHEN |
| 12/12/2023 | 8542399010 | MONOLITHIC INTEGRAL CIRCUIT. CHIP COMPONENT FOR INSTALLATION ON OVEN | XXXXXXXXXX | 45 | N/A | 985 | United States | SHENZHEN |
| 12/12/2023 | 8542339000 | MONOLITHIC INTEGRAL CIRCUIT. AMPLIFIERS. CHIP COMPONENT DL | XXXXXXXXXX | 360 | N/A | 24745 | United States | SHENZHEN |
| 12/12/2023 | 8542399010 | MONOLITHIC INTEGRAL CIRCUIT. CHIP COMPONENT FOR INSTALLATION ON OVEN | XXXXXXXXXX | 45 | N/A | 985 | United States | SHENZHEN |
| 12/12/2023 | 8541600000 | COLLECTED PIEZOELECTRIC CRYSTALS. CHIP COMPONENT FOR INSTALLATION ON A PRINTED BOARD. ELECTRONIC CIRCUIT DEVICE FOR INDUSTRIAL EQUIPMENT. NOT FOR MILITARY PURPOSE. NOT NUCLEAR ENGINEERING, NOT ELECTRICAL EQUIPMENT SCRAP; | XXXXXXXXXX | 45 | N/A | 91 | United States | SHENZHEN |
| 12/12/2023 | 8532240000 | CONSTANT CAPACITY CERAMIC MULTILAYER CAPACITORS, CHIP-KO | XXXXXXXXXX | 0 | N/A | 100 | United States | SHENZHEN |
| 12/12/2023 | 8532240000 | CONSTANT CAPACITY CERAMIC MULTILAYER CAPACITORS. CHIP-KO | XXXXXXXXXX | 0 | N/A | 120 | United Kingdom | SHENZHEN |