| 11/30/2023 | 85423900000 | DIE / WAFER PRODUCTION SUPPLIES | XXXXXXXXXX | 14281 | NA | 2626.65 | MALAYSIA | N/A |
| 11/30/2023 | 85423900000 | 242444.00 PE INTEGRATED CIRCUITS ON WAFER | XXXXXXXXXX | 242444 | NA | 53151.27 | GERMANY | N/A |
| 11/30/2023 | 85423900000 | WAFER | XXXXXXXXXX | 288 | NA | 91358.67 | JAPAN | N/A |
| 11/30/2023 | 85423900000 | PROCESSED WAFER RAW MATS FOR FURTHER PROCESSING | XXXXXXXXXX | 87 | NA | 42607.92 | USA | N/A |
| 11/30/2023 | 85423900000 | WAFER | XXXXXXXXXX | 25 | NA | 11931.15 | JAPAN | N/A |
| 11/30/2023 | 85423900000 | DIE IN WAFER FORM MATERIAL FOR PRODUCTION USE | XXXXXXXXXX | 2538 | NA | 284.19 | THAILAND | N/A |
| 11/30/2023 | 85423900000 | WAFER (INTEGRATED CIRCUITS) | XXXXXXXXXX | 95141 | NA | 145183.68 | Taiwan | N/A |
| 11/30/2023 | 85423900000 | WAFER | XXXXXXXXXX | 117 | NA | 55482.41 | JAPAN | N/A |
| 11/30/2023 | 85423900000 | DIE IN WAFER FORM | XXXXXXXXXX | 1320459 | NA | 85606.88 | USA | N/A |
| 11/30/2023 | 85423900000 | WAFER | XXXXXXXXXX | 897 | NA | 244109.61 | Taiwan | N/A |