| 11/30/2023 | 85411000000 | CHIP IN WAFER | XXXXXXXXXX | 120204 | NA | 150716.81 | SOUTH KOREA | N/A |
| 11/27/2023 | 85411000000 | CHIP IN WAFER | XXXXXXXXXX | 72310 | NA | 119647.11 | SOUTH KOREA | N/A |
| 11/27/2023 | 85411000000 | 7309.00 PE DMP 43-12 AL PI IM WAFER L | XXXXXXXXXX | 7309 | NA | 4417.01 | GERMANY | N/A |
| 11/27/2023 | 85411000000 | INTEGRATED CIRCUIT IN WAFER FORM | XXXXXXXXXX | 65105 | PIECE | 320795.2 | USA | N/A |
| 11/25/2023 | 85411000000 | DICE IN WAFER | XXXXXXXXXX | 18054 | PIECE | 351.52 | USA | N/A |
| 11/24/2023 | 85411000000 | RAW MATERIALS FOR DIODE MANUFACTURE (SILICON WAFER/SILICON CHIP) | XXXXXXXXXX | 79183 | NA | 34989.22 | JAPAN | N/A |
| 11/24/2023 | 85411000000 | DIODE WAFER | XXXXXXXXXX | 48000 | PIECE | 1104.4 | SOUTH KOREA | N/A |
| 11/23/2023 | 85411000000 | SILICON WAFER | XXXXXXXXXX | 101 | PIECE | 2159.35 | USA | N/A |
| 11/23/2023 | 85411000000 | INTEGRATED CIRCUIT IN WAFER FORM | XXXXXXXXXX | 1527 | PIECE | 433.54 | USA | N/A |
| 11/21/2023 | 85411000000 | INTEGRATED CIRCUIT IN WAFER FORM | XXXXXXXXXX | 13922 | PIECE | 96646.33 | USA | N/A |