11/30/2023 | 85429000000 | CERAMIC SUBSTRATES | XXXXXXXXXX | 0 | NA | 5870.05 | CHINA | N/A |
11/22/2023 | 85429000000 | 50.00 PE CERAMIC KEY CHIP FOR CAR KEY | XXXXXXXXXX | 0 | NA | 61.27 | CHINA | N/A |
11/21/2023 | 85429000000 | COAXIAL CONNECTORS, HALO ELECTRONICS MODULAR CONNECTORS, HEAT SINK, LINEAR VOLTAGE REGULATOR IC, MULTILAYER CERAMIC CAPACITOR, SCREWS & FASTENERS, TEST SOCKETS | XXXXXXXXXX | 0 | NA | 4573.11 | USA | N/A |
11/16/2023 | 85429000000 | PRINTED CIRCUIT HAVING A CERAMIC BASE 16440.00PCS | XXXXXXXXXX | 0 | NA | 18599.86 | SINGAPORE | N/A |
11/14/2023 | 85429000000 | MULTILAYER CERAMIC PACKAGE/PARTS FOR ASSEMBLY OF ELECTRONIC IC PACKAGING MATERIALS | XXXXXXXXXX | 0 | NA | 62163.13 | JAPAN | N/A |
11/8/2023 | 85429000000 | MULTILAYER CERAMIC PACKAGE | XXXXXXXXXX | 0 | NA | 63008.46 | JAPAN | N/A |
10/27/2023 | 85429000000 | CERAMIC PACKAGE /98730.00 PCS/ | XXXXXXXXXX | 0 | NA | 38215.55 | JAPAN | N/A |
10/26/2023 | 85429000000 | MULTILAYER CERAMIC PACKAGE/PARTS FOR ASSEMBLY OF ELECTRONIC IC PACKAGING MATERIALS | XXXXXXXXXX | 0 | NA | 63758.09 | JAPAN | N/A |
10/25/2023 | 85429000000 | CERAMIC SUBSTRATES (SU-0249-DP REV.1) | XXXXXXXXXX | 0 | NA | 22715.7 | CHINA | N/A |
10/20/2023 | 85429000000 | MULTILAYER CERAMIC PACKAGE/PARTS FOR ASSEMBLY OF ELECTRONIC IC PACKAGING MATERIALS | XXXXXXXXXX | 0 | NA | 63628.43 | JAPAN | N/A |