| 11/30/2023 | 85423900000 | DIE / WAFER PRODUCTION SUPPLIES | XXXXXXXXXX | 14281 | NA | 2626.65 | MALAYSIA | N/A |
| 11/30/2023 | 85423900000 | DIE IN WAFER FORM MATERIAL FOR PRODUCTION USE | XXXXXXXXXX | 2538 | NA | 284.19 | THAILAND | N/A |
| 11/30/2023 | 85423900000 | DIE IN WAFER FORM | XXXXXXXXXX | 1320459 | NA | 85606.88 | USA | N/A |
| 11/30/2023 | 85423900000 | WAFER /DIE | XXXXXXXXXX | 214426 | NA | 189717.01 | AUSTRIA | N/A |
| 11/30/2023 | 85423900000 | DIE SALES | XXXXXXXXXX | 601266 | NA | 167020.38 | JAPAN | N/A |
| 11/30/2023 | 85423900000 | DIE IN WAFER FORM | XXXXXXXXXX | 56166 | NA | 5442.37 | THAILAND | N/A |
| 11/30/2023 | 85423900000 | WAFER /DIE | XXXXXXXXXX | 214426 | NA | 189717.01 | AUSTRIA | N/A |
| 11/30/2023 | 85423900000 | WAFER DIE UNMOUNTED CHIPS DICE AND WAFERS FOR SEMICONDUCTOR DEVICES RAW MATERIALS FOR IC ASSEMBLY | XXXXXXXXXX | 714687 | NA | 20375.32 | USA | N/A |
| 11/30/2023 | 85423900000 | 40051.00 EA DIE ON WAFER | XXXXXXXXXX | 40051 | NA | 12277.1 | MALAYSIA | N/A |
| 11/30/2023 | 85423900000 | Die in Wafer Form | XXXXXXXXXX | 214831 | NA | 80374.04 | THAILAND | N/A |