| 11/30/2023 | 85423900000 | INTEGRATED CIRCUIT RAW MATS FOR FURTHER PROCESSING | XXXXXXXXXX | 1 | NA | 55.81 | USA | N/A |
| 11/30/2023 | 85423900000 | PROCESSED WAFER RAW MATS FOR FURTHER PROCESSING | XXXXXXXXXX | 87 | NA | 42607.92 | USA | N/A |
| 11/30/2023 | 85423900000 | DIE IN WAFER FORM MATERIAL FOR PRODUCTION USE | XXXXXXXXXX | 2538 | NA | 284.19 | THAILAND | N/A |
| 11/30/2023 | 85423900000 | INTEGRATED CIRCUITS (RAW MATERIALS USED IN THE PRODUCTION OF CHASSIS) | XXXXXXXXXX | 90000 | PIECE | 18983.55 | Hong Kong | N/A |
| 11/30/2023 | 85423900000 | INTEGRATED CIRCUITS RAW MATERIAL | XXXXXXXXXX | 1400 | PIECE | 835.1 | THAILAND | N/A |
| 11/30/2023 | 85423900000 | INTEGRATED CIRCUIT MOUNTED DICE RAW MATERIALS USED IN THE PRODUCTION OF CHASSIS | XXXXXXXXXX | 2000 | NA | 1296.35 | SINGAPORE | N/A |
| 11/30/2023 | 85423900000 | PROCESSED WAFER RAW MATS FOR FURTHER PROCESSING | XXXXXXXXXX | 50 | NA | 31091.55 | USA | N/A |
| 11/30/2023 | 85423900000 | INTEGRATED CIRCUITS (RAW MATERIAL IC MNFG.) | XXXXXXXXXX | 6409 | NA | 4829.3 | MALAYSIA | N/A |
| 11/30/2023 | 85423900000 | INTEGRATED CIRCUITS (RAW MATERIALS USE IN THE CHASSIS UNIT) | XXXXXXXXXX | 264000 | PIECE | 56529.22 | Hong Kong | N/A |
| 11/30/2023 | 85423900000 | INTEGRATED CIRCUITS RAW MATERIAL | XXXXXXXXXX | 336 | PIECE | 204.95 | CHINA | N/A |