11/27/2023 | 85423900000 | IC WAFER RAW MATERIAL FOR PRODUCT ENCAPSULATION | XXXXXXXXXX | 8 | PIECE | 38.83 | INDONESIA | N/A |
11/16/2023 | 85423900000 | IC WAFER RAW MATERIAL FOR PRODUCT ENCAPSULATION | XXXXXXXXXX | 2136 | PIECE | 56.4 | CHINA | N/A |
11/3/2023 | 85423900000 | IC WAFER RAW MATERIAL FOR PRODUCT ENCAPSULATION | XXXXXXXXXX | 5 | PIECE | 25.02 | THAILAND | N/A |
10/19/2023 | 85423900000 | IC (WAFER,RAW MATERIAL FOR PRODUCT ENCAPSULATION) | XXXXXXXXXX | 100 | PIECE | 5.59 | JAPAN | N/A |
9/28/2023 | 85423900000 | IC WAFER RAW MATERIAL FOR PRODUCT ENCAPSULATION | XXXXXXXXXX | 3 | PIECE | 38.16 | SOUTH KOREA | N/A |
9/11/2023 | 85423900000 | IC WAFER RAW MATERIAL FOR PRODUCT ENCAPSULATION | XXXXXXXXXX | 11 | PIECE | 39.56 | CHINA | N/A |
6/15/2023 | 85423900000 | IC WAFER RAW MATERIAL FOR PRODUCT ENCAPSULATION | XXXXXXXXXX | 2 | PIECE | 36.65 | SOUTH KOREA | N/A |