| 11/10/2023 | 84869042000 | BONDERS AND OF ENCAPSULATION TEST HEAD ASSEMBLY PIN CONTACT UU S-PIN P/N.UU34-TG1-01 | XXXXXXXXXX | 0 | NA | 912.85 | MALAYSIA | N/A |
| 11/9/2023 | 84869042000 | BONDERS AND OF ENCAPSULATION CLAMP HEATSINK LEFT CLAMP USESD IN CLAMPING LEADFRAMES AT WIRE BONDER TO HOLD FIRM DURING WIRE BONDING PROCESS | XXXXXXXXXX | 0 | NA | 671.86 | SINGAPORE | N/A |
| 11/2/2023 | 84869042000 | BONDERS AND OF ENCAPSULATION CLAMP HEATSINK LEFT | XXXXXXXXXX | 0 | NA | 703.23 | SINGAPORE | N/A |
| 10/25/2023 | 84869042000 | BONDERS AND OF ENCAPSULATION WIRE GUIDES LOA NO 23-CIP2-GL-EE/ELSE-0561 VALID UNTIL MAY 18 2024 | XXXXXXXXXX | 0 | NA | 1143.32 | SINGAPORE | N/A |
| 10/11/2023 | 84869042000 | - - - Of die attach apparatus tape automated bonders wire bonders and of encapsulation | XXXXXXXXXX | 0 | NA | 6480.69 | MALAYSIA | N/A |
| 10/4/2023 | 84869042000 | BONDERS AND OF ENCAPSULATION CLAMP HEATSINK LEFT CLAMP USESD IN CLAMPING LEADFRAMES AT WIRE BONDER TO HOLD FIRM DURING WIRE BONDING PROCESS | XXXXXXXXXX | 0 | NA | 673.17 | SINGAPORE | N/A |
| 9/18/2023 | 84869042000 | BONDERS AND OF ENCAPSULATION UNIT STOPPER ASSY PARTS OF BONDER MACHINE | XXXXXXXXXX | 0 | NA | 262.48 | Hong Kong | N/A |
| 9/14/2023 | 84869042000 | BONDERS AND OF ENCAPSULATION GRIPPER HEATSINK SOT669 MACHINE PARTS | XXXXXXXXXX | 0 | NA | 1246.73 | Hong Kong | N/A |
| 9/14/2023 | 84869042000 | BONDERS AND OF ENCAPSULATION CLAMP HEATSINK LEFT CLAMP USESD IN CLAMPING LEADFRAMES AT WIRE BONDER TO HOLD FIRM DURING WIRE BONDING PROCESS | XXXXXXXXXX | 0 | NA | 1046.33 | SINGAPORE | N/A |
| 9/6/2023 | 84869042000 | BONDERS AND OF ENCAPSULATION CLAMP HEATSINK LEFT CLAMP USESD IN CLAMPING LEADFRAMES AT WIRE BONDER TO HOLD FIRM DURING WIRE BONDING PROCESS | XXXXXXXXXX | 0 | NA | 677.99 | SINGAPORE | N/A |