11/30/2023 | 39073090000 | EPOXY MOLDING COMPOUND (DIRECT MATERIAL FOR PRODUCTION) (315 KGS) | KCC CORPORATION | 0 | NA | 6201.01 | SOUTH KOREA | N/A |
11/30/2023 | 39073090000 | 210.00 KG EPOXY MOLDING COMPOUND | KCC CORPORATION | 0 | NA | 4817.28 | SOUTH KOREA | N/A |
11/30/2023 | 39073090000 | 345.00 KG EPOXY MOLDING COMPOUND | KCC CORPORATION | 0 | NA | 7883.53 | SOUTH KOREA | N/A |
11/30/2023 | 39073090000 | 75.00 KG EPOXY MOLDING COMPOUND | SUMITOMO BAKELITE COLTD | 0 | NA | 2226.78 | JAPAN | N/A |
11/30/2023 | 39073090000 | EPOXY MOLDING COMPOUND | RESONAC CORPORATION | 0 | NA | 42867.79 | JAPAN | N/A |
11/30/2023 | 39073090000 | EPOXY MOLDING COMPOUND EMC SG-8300TC/13X3.6 | SAMSUNG SDI CO LTD | 0 | NA | 30614.51 | SOUTH KOREA | N/A |
11/30/2023 | 39073090000 | EPOXY MOLDING COMPOUND (DIRECT MATERIAL FOR PRODUCTION) (70 KGS) | RESONAC COPORATION 191 HIGASHI | 0 | NA | 1069.75 | JAPAN | N/A |
11/30/2023 | 39073090000 | MOLDING COMPOUND SUMIKON RESIN TABLET | SUMITOMO BAKELITE SINGAPORE PTE LTD | 0 | NA | 6725.21 | SINGAPORE | N/A |
11/30/2023 | 39073090000 | MOLDING COMPOUND SUMIKON RESIN TABLET, INV NO.SBS-EME0231107065,66,67,68,69 | SUMITOMO BAKELITE SINGAPORE PTE LTD | 0 | NA | 104136.04 | SINGAPORE | N/A |
11/29/2023 | 39073090000 | MOLDING COMPOUND SUMIKON RESIN TABLET - 660 KGS | SUMITOMO BAKELITE CO LTD | 0 | NA | 12427.84 | JAPAN | N/A |