3/27/2024 | 034025019000 | RUBCLEAN MOLD CLEANING COMPOUND 30KG | CAPE TECHNOLOGY SDN BHD | 0 | N/A | 480 | MALAYSIA | N/A |
3/27/2024 | 039073090000 | EPOXY MOLDING COMPOUND | SHIN ETSU ELECTRONICS M SDN BHD | 0 | N/A | 71024.4 | MALAYSIA | N/A |
3/26/2024 | 039073090000 | EPOXY MOLDING COMPOUND, INV NO.RMM/403P36 | RESONAC MATERIALS MALAYSIA SDN BHD | 0 | N/A | 94893.1 | MALAYSIA | N/A |
3/26/2024 | 039073090000 | EPOXY MOLDING COMPOUND (300 KG) | RESONAC MATERIALS MALAYSIA SDN BHD | 0 | N/A | 11880 | MALAYSIA | N/A |
3/25/2024 | 040169390000 | 44 PCS BMW SEALING COMPOUND DOW CORNING | BMW ASIA TECHNOLOGY CENTER SDN BHD | 0 | N/A | 678 | MALAYSIA | N/A |
3/25/2024 | 039073090000 | EPOXY MOLDING COMPOUND CEL-9240HF10LS(45C)(8.2G) PART NO. 501122 - 160 KG. | RESONAC MATERIALS MALAYSIA SDN BHD | 0 | N/A | 4068.8 | MALAYSIA | N/A |
3/25/2024 | 039073090000 | EPOXY MOLDING COMPOUND CEL-9240HF10LS(45C)(8.2G) PART NO. 501122 - 140 KG. | RESONAC MATERIALS MALAYSIA SDN BHD | 0 | N/A | 3560.2 | MALAYSIA | N/A |
3/25/2024 | 039012000000 | 300 KGS HDPE COMPOUND | MACCAFERRI MALAYSIA SDN BHD | 0 | N/A | 399 | MALAYSIA | N/A |
3/22/2024 | 039073090000 | EPOXY MOLDING COMPOUND = 150 KGS | SHINETSU ELECTRONICS M SDN BHD | 0 | N/A | 2414.2 | MALAYSIA | N/A |
3/21/2024 | 018062010000 | 160 CARTONS BERYLS GOURMET INDSUTRIAL CHOCOLATE FOR BAKING BERYLS DARK COMPOUND CHIPS DR-LD88-NV *4,400CT/KG DARK CHOCOLATE COMPOUND CHIPS DR-LD88-NV BRAND NAME BERYLS | BERYLS CHOCOLATE And CONFECTION | 0 | N/A | 4176 | MALAYSIA | N/A |