| 8/15/2023 | 90330010 | PHOTODIODE, GREEN, 550NM, ACTIVE AREA 1.8MM, SMT (VARIOUS ASSETS FOR EXPORT TO COMPUTER COMPONENTS LTD (CCL) LOCATED AT UNITED KINGDOM (LOA NO.23-EOD-EXP-RM-EEE-1921 VALID UNTIL MAY 07, 2024) | XXXXXXXXXX | 149393 | PIECES | 5019.6 | United Kingdom | NA |
| 7/11/2023 | 85414900 | INP SEMICONDUCTOR PHOTODIODE WAFER RAW MATERIALS USE FOR BONDING OF ALL IC PRODUCTS BACK TO VENDOR | XXXXXXXXXX | 1 | BOX | 6.48 | United Kingdom | NA |
| 6/23/2023 | 85414900 | INP SEMICONDUCTOR PHOTODIODE WAFER RAW MATERIALS USE FOR BONDING OF ALL IC PRODUCTS BACK TO VENDOR | XXXXXXXXXX | 1 | BOX | 24372.36 | United Kingdom | NA |
| 6/23/2023 | 85414900 | INP SEMICONDUCTOR PHOTODIODE WAFER RAW MATERIALS USE FOR BONDING OF ALL IC PRODUCTS BACK TO VENDOR | XXXXXXXXXX | 1 | BOX | 2.16 | United Kingdom | NA |
| 6/15/2023 | 85414900 | INP SEMICONDUCTOR PHOTODIODE WAFER RAW MATERIALS USE FOR BONDING OF ALL IC PRODUCTS BACK TO VENDOR | XXXXXXXXXX | 1 | BOX | 12.96 | United Kingdom | NA |
| 6/15/2023 | 85414900 | INP SEMICONDUCTOR PHOTODIODE WAFER RAW MATERIALS USE FOR BONDING OF ALL IC PRODUCTS BACK TO VENDOR | XXXXXXXXXX | 1 | BOX | 5893.56 | United Kingdom | NA |
| 6/9/2023 | 85414900 | INP SEMICONDUCTOR PHOTODIODE WAFER RAW MATERIALS USE FOR BONDING OF ALL IC PRODUCTS BACK TO VENDOR | XXXXXXXXXX | 5 | BOX | 6 | United Kingdom | NA |
| 5/17/2023 | 85414900 | INP SEMICONDUCTOR PHOTODIODE WAFER RAW MATERIALS USE FOR BONDING OF ALL IC PRODUCTS BACK TO VENDOR | XXXXXXXXXX | 1 | BOX | 12.96 | United Kingdom | NA |
| 4/18/2023 | 85414900 | INP SEMICONDUCTOR PHOTODIODE WAFER RAW MATERIALS USE FOR BONDING OF ALL IC PRODUCTS BACK TO VENDOR | XXXXXXXXXX | 2 | BOX | 63329.04 | United Kingdom | NA |