12/27/2023 | 85423200 | ESM38D15160 IC MEM,UMCP,128+4,FBGA,KM5L9001DM-B424 (BRAND MOTOROLA) (FOR MFG. OF PCBA FOR MOBILE PHONE) (CAPTIVE CONSUMP 85 | XXXXXXXXXX | 6000 | NOS | 61495.75 | CHINA | DELHI ACC |
12/20/2023 | 85423200 | ESM38D15160 IC MEM,UMCP,128+4,FBGA,KM5L9001DM-B424 (BRAND MOTOROLA)FOR MFG OF PCB ASSEMBLY FOR MOBILE PHONE) (CAPTIVE CO 85 | XXXXXXXXXX | 8000 | NOS | 82483.56 | CHINA | DELHI ACC |
12/12/2023 | 85423200 | ESM38D29797 IC MEM,uMCP,4+128,MT29VZZZCD91SFSM-046 W.18 (BRAND MOTOROLA) (FOR MFG.OF PCB ASSEMBLY FOR MOBILR PHONE) (CAP 85 | XXXXXXXXXX | 3 | NOS | 31.46 | CHINA | DELHI ACC |
12/11/2023 | 85423200 | 1105-002424 IC-DDR3 SDRAM; MT41K128M,DDR3,2GBIT,128 85 | XXXXXXXXXX | 2 | NOS | 4.96 | South Korea | DELHI ACC |
12/11/2023 | 85423200 | SM38D29400 IC MEM,uMCP,8+128,MT29VZZZCD91SKSM-046 W.17 (BRAND MOTOROLA) (FOR MFG. OF MOBILE PHONE) (CAPTIVE CONSUMPTION) 85 | XXXXXXXXXX | 2000 | NOS | 38378.86 | CHINA | DELHI ACC |
12/9/2023 | 85423200 | SM38D29400 MEM,UMCP,8+128,MT29VZZZCD91SKSM-046 W.17 (IC (INTEGRATED CIRCUIT)) (FOR MANUFACTURING OF PCBA OF MOTOROLA MOB 85 | XXXXXXXXXX | 1278 | NOS | 24361.88 | TAIWAN | DELHI ACC |
12/9/2023 | 85423200 | ESM38D15160 MEM, UMCP,128+4, FBGA, KM5L9001DM-B424 IC (FOR MFG OF PCBA OF MOTOROLA MOBILE PHONE) 85 | XXXXXXXXXX | 23350 | NOS | 240748.89 | CHINA | DELHI ACC |
12/6/2023 | 85423200 | 454347, 2K,128 X 16,SERIAL EE,SOIC-8 85 | XXXXXXXXXX | 20 | NOS | 5.1 | UNITED KINGDOM | DELHI ACC |
11/29/2023 | 85423200 | ESM38D15160 MEM,UMCP,128+4,FBGA,KM5L9001DM-B424 IC (PARTS OFPCBA FOR MANUFATURING OF MOBILE PHONE) | XXXXXXXXXX | 16000 | NOS | 164575.74 | CHINA | DELHI AIR CARGO ACC |
11/28/2023 | 85423200 | ESM38D15160 MEM,UMCP,128+4,FBGA,KM5L9001DM-B424 IC (PARTS OFPCBA MANUFACTURING OF MOBILE PHONE) | XXXXXXXXXX | 10000 | NOS | 102859.84 | CHINA | DELHI AIR CARGO ACC |