3/31/2024 | 85423100 | [338S00839][INTEGRATED CIRCUIT](PARTS FOR USE IN MFG OF PCBAOF CELLULAR MOBILE PHONE) | XXXXXXXXXX | 109 | NOS | 108.38 | TAIWAN | CHENNAI AIR |
3/31/2024 | 85423100 | INTEGRATED CIRCUIT -PM-4450C-0-WLPSP20-HR-M0-0 (P/N.1270301000087A)(USE IN MFG.OF PCBA OF MOBILE PHONE) | XXXXXXXXXX | 20000 | PCS | 4388.87 | TAIWAN | DELHI AIR |
3/31/2024 | 85423100 | INTEGRATED CIRCUIT -MTFC128GAXAUEA-WT (P/N.1110301000034C)(USE IN MFG.OF PCBA OF MOBILE PHONE) | XXXXXXXXXX | 2000 | PCS | 24953.5 | TAIWAN | DELHI AIR |
3/31/2024 | 85423100 | BOP9110405-Transceiver chip(PART FOR MFG OF MOBILE PHONE PCBA)(CIMS NO:MEI202100612827) | XXXXXXXXXX | 225000 | PCS | 3540453.99 | TAIWAN | CHENNAI AIR |
3/31/2024 | 74102100 | GLASS EPOXY COPPER CLAD LAMINATES NP-155FR 1/1(35/35)1.6MM 1245MMX1045MM(FOR PCB MANUFACTRUING)200 SHEETS | XXXXXXXXXX | 912.4 | KGS | 4289.53 | TAIWAN | JNPT NHAVA SHEVA SEA |
3/31/2024 | 85423100 | INTEGRATED CIRCUIT -PM-4450-0-FOWPSP144C-HR-01-0 (P/N.1270301000084A)(USE IN MFG.OF PCBA OF MOBILE PHONE) | XXXXXXXXXX | 36000 | PCS | 68226.92 | TAIWAN | DELHI AIR |
3/31/2024 | 85423100 | INTEGRATED CIRCUIT -MTFC128GAXAUEA-WT (P/N.1110301000034C)(USE IN MFG.OF PCBA OF MOBILE PHONE) | XXXXXXXXXX | 12000 | PCS | 149721 | TAIWAN | DELHI AIR |
3/31/2024 | 74102100 | GLASS EPOXY COPPER CLAD LAMINATES CEM-3-10 H/H(18/18) 1.0MM1245MMX1092MM(FOR PCB MANUFACTRUING)3000 SHEETS | XXXXXXXXXX | 8517 | KGS | 44615.2 | TAIWAN | SAHAR AIR |
3/31/2024 | 74102100 | GLASS EPOXY COPPER CLAD LAMINATES CEM-3-10 H/H(18/18) 1.6MM1245MMX1092MM(FOR PCB MANUFACTRUING)400 SHEETS | XXXXXXXXXX | 1654 | KGS | 7535.01 | TAIWAN | JNPT NHAVA SHEVA SEA |
3/31/2024 | 74102100 | GLASS EPOXY COPPER CLAD LAMINATES NP-155FR 1/1(35/35)1.6MM 1245MMX1045MM(FOR PCB MANUFACTRUING)124 SHEETS | XXXXXXXXXX | 565.69 | KGS | 2659.51 | TAIWAN | JNPT NHAVA SHEVA SEA |