3/30/2024 | 74099000 | GLASS EPOXY COPPER CLAD LAMINATES MOD:FR4 0.1MM 35/35 HIGH TG170 41X49" WITHOUT LOGO UV BLOCK A GRADE EXCLUDING COPPER | XXXXXXXXXX | 50 | NOS | 705.61 | CHINA | CHENNAI AIR |
3/30/2024 | 74099000 | GLASS EPOXY COPPER CLAD LAMINATES MOD:FR4 0.4MM 105/105 HIGHTG170 41X49" WITHOUT LOGO UV BLOCK A GRADE EXCLUDING COPPER | XXXXXXXXXX | 50 | NOS | 2180.98 | CHINA | CHENNAI AIR |
3/30/2024 | 74099000 | GLASS EPOXY COPPER CLAD LAMINATES MOD:FR4 0.2MM 105/105 HIGHTG170 41X49" WITHOUT LOGO UV BLOCK A GRADE EXCLUDING COPPER | XXXXXXXXXX | 60 | NOS | 2501.72 | CHINA | CHENNAI AIR |
3/30/2024 | 74099000 | GLASS EPOXY COPPER CLAD LAMINATES MOD:FR4 0.2MM 70/70 HIGH TG170 41X49" WITHOUT LOGO UV BLOCK A GRADE EXCLUDING COPPER | XXXXXXXXXX | 40 | NOS | 1077.66 | CHINA | CHENNAI AIR |
3/29/2024 | 74099000 | SHEET,COPPER - RAA34445404 (NFMIMS NO.MIN202100382710 DT.27.02.2024) | XXXXXXXXXX | 24000 | PCS | 561.31 | South Korea | SAHAR AIR |
3/29/2024 | 74099000 | SHEET,COPPER - RAA34445404 (NFMIMS NO.MIN202100382710 DT.27.02.2024) | XXXXXXXXXX | 24000 | PCS | 573.56 | South Korea | SAHAR AIR |
3/27/2024 | 74099000 | ESM88D42825 HDW,PLT,DUBAI+NA,COPPER_PLATE_MMW_TOP COPPER PART (PARTS FOR MANUFACTURING OF MOBILE PHONE) | XXXXXXXXXX | 63 | NOS | 0.84 | CHINA | DELHI AIR |
3/25/2024 | 74099000 | TINNED COPPER INTERCONNECT -0.5MM(W)X0.25MM (T) -STTR0R5X0R2X3-(FOR MFGOF SOLAR POWER GENERATING SYSTEM) | XXXXXXXXXX | 100 | KGS | 2083.05 | CHINA | BANGALORE AIR |
3/22/2024 | 74099000 | CUPRO NICKEL Cu 70 Ni 30 (70:30), 1.0 mm Sheet, RMCUNISHT002(Copper Nickel Sheet For Moulded Case Circuit Breaker) | XXXXXXXXXX | 150 | KGS | 6868.43 | CHINA | DELHI AIR |
3/22/2024 | 74099000 | COPPER ALLOY RESISTANCE STRIP RESISTANCE ALLOY MC-1,SIZE 1.60X80 MM,(FOR INDUSTRIAL USE) | XXXXXXXXXX | 441.3 | KGS | 19363.01 | JAPAN | DELHI AIR |