| 3/29/2024 | 38180090 | FOC WAFERS (QTY= 10 NOS) (FOR R&D PURPOSE ONLY) | XXXXXXXXXX | 2.7 | KGS | 122.54 | USA | BANGALORE AIR |
| 3/23/2024 | 38180090 | S045071-100MM SOI WAFERS (FOR RESEARCH USE ONLY) P.O.NO. 4300004682 | XXXXXXXXXX | 10 | PCS | 3491.92 | USA | BANGALORE AIR |
| 3/21/2024 | 34070090 | ALUWAX U-SHAPE BITE WAFERS | XXXXXXXXXX | 35 | NOS | 513.14 | USA | SAHAR AIR |
| 3/14/2024 | 38180090 | HS39626-OXS: 4 P/B <100> [ SINGLE CRYSTAL SILICON WAFERS FORRESEARCH USE ONLY ] ( P.O. NO. 4500034092) | XXXXXXXXXX | 15 | NOS | 1274.09 | USA | SAHAR AIR |
| 3/14/2024 | 38180090 | 4I0-11370-OX:4 INTRINSIC <100> FZ >100 [ SINGLE CRYSTAL SILICON WAFERS FOR RESEARCH USE ONLY ] ( P.O. NO. 4500034092) | XXXXXXXXXX | 25 | NOS | 3539.15 | USA | SAHAR AIR |
| 3/8/2024 | 85423100 | DICE,ICS ( UNMOUNTED CHIPS DICE & WAFERS) ( FOR MANUFACTURING OF MICORWAVE SUB ASSEMBLIES AND COMM. USED IN DEFENCE ) | XXXXXXXXXX | 84 | NOS | 121.04 | USA | DELHI AIR |
| 3/8/2024 | 85423100 | DICE,ICS ( UNMOUNTED CHIPS DICE & WAFERS) ( FOR MANUFACTURING OF MICORWAVE SUB ASSEMBLIES AND COMM. USED IN DEFENCE ) | XXXXXXXXXX | 84 | NOS | 74.64 | USA | DELHI AIR |
| 3/8/2024 | 85423100 | DICE,ICS ( UNMOUNTED CHIPS DICE & WAFERS) ( FOR MANUFACTURING OF MICORWAVE SUB ASSEMBLIES AND COMM. USED IN DEFENCE ) | XXXXXXXXXX | 3 | NOS | 6.05 | USA | DELHI AIR |
| 3/8/2024 | 85423100 | DICE,ICS ( UNMOUNTED CHIPS DICE & WAFERS) ( FOR MANUFACTURING OF MICORWAVE SUB ASSEMBLIES AND COMM. USED IN DEFENCE ) | XXXXXXXXXX | 231 | NOS | 258.22 | USA | DELHI AIR |
| 3/8/2024 | 38180090 | BOROFLOAT 33 SCHOTT WAFERS,DIAMETER:4-IN (100 + 0.5MM)THICKNESS:500+250UM, AS PER PO | XXXXXXXXXX | 200 | NOS | 5668.73 | USA | CHENNAI AIR |