9/29/2023 | 85437099 | OPT-999 AD TESTING KIT FOR ATTE1500FFD01 | AAEON TECHNOLOGY INC | 1 | NOS | 127.47 | TAIWAN | TAIPEI |
9/29/2023 | 85437099 | (FOC) 5412B0050031 HALB BOARD ASSEMBLY TF-DEVELOPMENT KIT; SBU, OREGON,TA#M46319-003, MOD POK UPGRADE KIT (FOR R&D USE) | MITAC COMPUTING TECHNOLOGY CORP | 6 | SET | 8492.52 | TAIWAN | TAIPEI |
9/29/2023 | 85437099 | 10-32761-0260 / DTP, TOP ASSEMBLY, ADP RIDE 4.0 MX ARNAGE, LEMANSAU QAM8775P V2 AB QAM8775P V2 AB, THERMAL | QUALCOMM SEMICONDUCTOR LIMITED OBO | 2 | NOS | 10748.08 | TAIWAN | TAIPEI |
9/29/2023 | 85437099 | 10-49050-0030 / DTP, TOP ASSEMBLY, ADP RIDE 4.0 SX MASSENET,MONACOAU SRV1-L, K2.0, LP5 8GB, NON-THERMAL | QUALCOMM SEMICONDUCTOR LIMITED OBO | 1 | NOS | 2648.43 | TAIWAN | TAIPEI |
9/29/2023 | 85437099 | 10-32761-0260 / DTP, TOP ASSEMBLY, ADP RIDE 4.0 MX ARNAGE, LEMANSAU QAM8775P V2 AB QAM8775P V2 AB, THERMAL | QUALCOMM SEMICONDUCTOR LIMITED OBO | 1 | NOS | 5374.04 | TAIWAN | TAIPEI |
9/29/2023 | 85437099 | 10-32761-0260 / DTP, TOP ASSEMBLY, ADP RIDE 4.0 MX ARNAGE, LEMANSAU QAM8775P V2 AB QAM8775P V2 AB, THERMAL | QUALCOMM SEMICONDUCTOR LIMITED OBO | 1 | NOS | 5374.04 | TAIWAN | TAIPEI |
9/29/2023 | 85437099 | 10-32761-0260 / DTP, TOP ASSEMBLY, ADP RIDE 4.0 MX ARNAGE, LEMANSAU QAM8775P V2 AB QAM8775P V2 AB, THERMAL | QUALCOMM SEMICONDUCTOR LIMITED OBO | 2 | NOS | 10748.08 | TAIWAN | TAIPEI |
9/28/2023 | 85437099 | (FOC) FU111703E017A SECURITY APPLIANCED SAF703EEBI-1221-11 OPEN CHASSIS POK (M77417-002) (FOR R&D PURPOSE) | ACCTON TECHNOLOGY CORPORATION | 9 | PCS | 3948.77 | TAIWAN | TAIPEI |
9/28/2023 | 85437099 | (FOC) FU111703E017A SECURITY APPLIANCES SAF703EEBI-1221-11(M77417-002,),1 O OPEN CHASSIS POK (FOR R & D PURPOSE) | ACCTON TECHNOLOGY CORPORATION | 1 | PCS | 438.75 | TAIWAN | TAIPEI |
9/28/2023 | 85437099 | (FOC) FU111703E017A SECURITY APPLIANCES SAF703EEBI-1221-11(M77417-002,),1 O OPEN CHASSIS POK (FOR R & D PURPOSE) | ACCTON TECHNOLOGY CORPORATION | 11 | PCS | 4826.27 | TAIWAN | TAIPEI |